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Reimagining Innovation with Dependable Electronics

The automotive industry is facing large structural change as vehicles are undergoing a profound transformation. The reasons are the desire for ever smarter and ever more connected cars, the need to comply with ever stricter emission standards and the calls for sustainable mobility.

The future car is fully connected and always online. It is all-electric and autonomous. Advancement in automotive innovation depends on microelectronics – and thus on semiconductors such as Infineon’s. Semiconductors are the backbone of technological developments that support the automotive megatrends: electro-mobility, automated driving, connectivity and cybersecurity.


Dependable electronics based on cybersecurity

Cybersecurity is a prerequisite for all safety-critical applications of a car. But it is also important for other vehicle application fields such as body and convenience, chassis, cluster and infotainment, powertrain and energy management.

Infineon helps enable a dependable and secured vehicle architecture as well as highly secured data exchange between the various on-board systems and with other vehicles and the infrastructure.

We are convinced that cybersecurity “by design” is essential. With cybersecurity comprising of hardware, software and associated ecosystems – the path forward should incorporate a comprehensive cybersecurity system approach with strong cooperation of trustful and reliable partners across the whole automotive value chain. > Learn more

Dependable electronics based on Functional Safety

The transformation in the automotive industry is being driven by megatrends such as automated driving and connectivity, all of which increase the need for safe electronic systems. These systems require highly integrated and safe electronic semiconductors. Today’s standard for safe automated and safe autonomous systems is the ISO26262 that is already implemented in the Infineon automotive products and well-established in the company’s development processes and all product support activities.

Infineon is actively monitoring the trends in the automotive industry. We provide components and chipsets as well as system knowledge to support all safety-relevant automotive systems. Our broad product portfolio addresses a wide range of functionalities with sensors, computing and actuating chips complemented by power supply chips and communication ICs.

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Dependable electronics onboard an EV

Infineon offers the broadest automotive portfolio of products and technologies in the semiconductor industry, including power semiconductors that are at the heart of eMobility. Along with comprehensive system expertise for electric drives, Infineon offers full system solutions addressing all xEV segments including pure EVs, hybrid EVs, and EVs based on emerging hydrogen technology.

Demonstrating the power and convenience of an electric vehicle (EV), Volkswagen of America has teamed up with long-distance driving expert Rainer Zietlow for the VW ID.4 USA tour. Under the sponsorship of Infineon, Zietlow and his team have attained a GUINNESS WORLD RECORDS™ title. The record was set for the longest journey by an electric vehicle in a single country, crossing 35,840.67 miles between July 13, 2021 to October 18, 2021.

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Fueling a new era of automotive and industrial innovation

Every day, customers rely on vehicles and systems that depend on our NOR flash technology to operate smoothly and prevent accidents. Your safety is our number one priority, and failure is not an option. That's why all of our high-density Semper™ NOR flash memory devices exceed automotive quality, functional safety requirements, and are engineered to last.

The Semper NOR Flash Memory Family is a safe and reliable NOR Flash memory solution that integrates critical safety features for automotive and industrial systems.


ToF 3D image sensors for automotive

Our > REAL3™ automotive imager based on 3D time-of-flight (ToF) technology brings the most accurate and robust depth sensing capabilities to a wide range of automotive use cases both within and beyond the vehicle.

As cars evolve to support a greater degree of automated driving and more intuitive ways for the driver and passengers to interact with the vehicle (HMI), designers are increasingly focusing on freedom, flexibility, comfort and – most importantly – safety. Our REAL3™ 3D in-cabin sensing cameras capture and process the data needed to ensure a high standard of passive safety through use cases like occupant detection and smart airbag systems. They also support exterior sensing functions such as secure navigation and collision avoidance. In addition, comfort features such as gesture control and fully autonomous parking pave the way for maximum driver convenience. Here, high-resolution ToF cameras use 3D sensing to scan the area around the car down to the ground to detect curbs, walls or other obstacles – regardless of how bright or dark it is.

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Rich visual user experience with the best cost of system ownership

Infineon has an unparalleled portfolio for a scalable instrument cluster platform on the market. Traveo™ and Traveo™ II microcontroller product families provide the most extensive scalability, which covers the conventional gauge instrument cluster and hybrid instrument cluster, as well as the virtual instrument cluster. The option of line-based operation of the graphics engine within the microcontroller minimizes the memory required for graphics processing. With the optimized 2.5D graphics engine and extended density of embedded Flash and Video RAM, Traveo™ II graphic MCU can support the virtual instrument cluster with high resolution up to 2880 x 1080. Infineon’s SemperFlash™ and HyperRAM™ memory products provide performance and density scalability to meet the requirements of different instrument cluster systems. These high-performance memory devices provide an ideal solution for real-time graphics and high-speed access. The low-pin count interface also reduces design complexity and PCB size to save on design costs.

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