The leadless SMD package for CoolMOS™ superjunction (SJ) MOSFET
The ThinPAK 5x6 package is a leadless SMD package especially designed for high voltage MOSFETs. This package has a very small footprint of 5x6mm² and a very low profile with only 1mm height. The significantly smaller package size in combination with its benchmark low parasitics inductances can be used as a new and effective way to decrease system solution size in power- density driven designs.
The ThinPAK 5x6 package is characterized by a very low source inductance 1.6nH, as well as a similar thermal performance as DPAK. The package hence enables faster and thus more efficient switching of power MOSFETs and is easier to handle in terms of switching behavior and EMI.
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