Mobile World Congress: A new level of convenience and security for smart device transactions
Munich, Germany, and Barcelona, Spain – 26 February 2019 – For today’s consumers, it’s all about convenience – everything has to be intuitive and fast - while security is a must. An increasingly mobile lifestyle in particular requires new forms of authentication and device convergence for all kinds of digital transactions. At stand 6C41 in Hall 6 of Mobile World Congress (MWC) in Barcelona (25-28 February 2019), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting semiconductor solutions for smart devices that enable a convenient and seamless user experience.
Building on a deep understanding of the payment ecosystem, Infineon develops sensor and security solutions that meet consumer requirements. Infineon’s chip solutions help to simplify everyday activities such as paying with smartphone or changing the mobile network provider – the user’s identity is conveniently confirmed with a face scan.
3D face scan for reliable and convenient user authentication
Infineon’s REAL3™ image sensor chip built into a mobile device allows fast, seamless and secured user authentication. Face or hand recognition can be quickly and easily used to unlock a device or for two-factor authentication to authorize payments. The sensor can also be used to scan a room to enhance augmented reality, morphing and special photo effects. Based on time-of-flight (ToF) technology, the REAL3 captures infrared light reflected off the scanned object. Compared with other 3D technologies, ToF works more reliably under all light conditions, including in the dark and bright sunlight, while also providing more robust security. Low power consumption by both the 3D camera and processor helps to extend the battery lifetime of mobile devices.
Smooth transfer of banking credentials from cards to connected devices
Infineon’s SECORA™ Pay portfolio consists of turnkey solutions for contactless payment cards such as Visa and Mastercard. In addition, SECORA solutions are used for smart wearables ranging from fashion accessories to battery-powered smart watches and fitness trackers. After the recent launch of SECORA Pay W, optimized for non-connected wearables such as key fobs, rings and wristbands, the latest addition to the product family, SECORA Connect, is targeted at battery-powered connected smart wearables such as smart watches. The solution combines a Secure Element with a system-in-package NFC antenna, allowing device manufactures to easily integrate and manage payment applications, transit ticketing or access solutions. This includes tokenizing credit or debit card credentials for contactless payment with smartphone or smart wearable. Thanks to an optimized design for wearable use cases, it reduces power consumption significantly and enables exceptionally long battery life.
Meeting consumer demand for MNO flexibility and customer-centric services
At the core of smart device transactions lies connectivity to the mobile network and the quality of radio communication to the reader. At MWC, Infineon is demonstrating an all-in-one solution which combines an embedded Secure Element for robust security with an embedded SIM (eSIM) for mobile communications and an NFC controller for high-speed contactless transactions. This high degree of integration within one chip package offers device manufacturers more options for their designs. It also turns the mobile phone into a device that ‘does it all’, storing personal data securely in the Secure Element and connecting quickly and securely to the reader thanks to Infineon’s contactless expertise. And, last but not least, the ability to switch mobile network providers on the go paves the way for more user flexibility and customer-centric services.
More information on Infineon at MWC 2019 is available at www.infineon.com/MWC.
Infineon’s chip solutions help to simplify everyday activities such as paying with smartphone and smart wearable or changing the mobile network provider.MWC2019_Payment_Smart_Wearables
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