Hybrid Electric Vehicle Power Module from Infineon Achieves High Efficiency and Reduces Complexity of Hybrid Designs
Detroit, Michigan and Munich, Germany – October 16, 2006 – At the Convergence trade show in Detroit, Infineon Technologies AG (FSE/NYSE: IFX) introduced the first two members of its new family of electronic power modules designed for hybrid electric vehicle (HEV) motor drive systems. Based on Infineon’s proven power semiconductors and a system-level design approach, the new HybridPACK1 and HybridPACK2 power modules reduce the cost and complexity of HEV inverter system design by using up to 30 percent less semiconductor area to achieve the required power rating. Infineon systems reduce electrical power losses by one fifth enabling simpler cooling systems.
”Our HybridPACK modules combine know-how based on our world’s number one position in advanced power electronics and world’s number two automotive electronics position with the commitment to excellence to meet the exceptional performance and reliability requirements of the world’s leading light vehicle manufacturers,” said Christopher Cook, General Manager of the Automotive, Industrial and Multimarket (AIM) Business Group, Infineon Technologies North America Corp. “By developing a family of modules, we provide manufacturers with tailored performance for the different types of hybrid systems to meet customer requirements.”
Designed for use in “mild” HEV vehicles, the Infineon HybridPACK1 power module contains all power semiconductors for the inverter and an NTC (Negative Temperature Coefficient) resistor for temperature measurement thus resulting in 30 percent less semiconductor area. The module is based on the unique combination of Infineon’s leading-edge Trench FieldStop IGBT (Insulated Gate Bipolar Transistor) and Emitter Controlled Diode technology. For mild hybrid inverter applications, the flat copper base-plate combined with high-performance ceramic substrate and Infineon’s enhanced wire-bonding process improves lifespan related to thermal cycling by a factor of 3 and lifespan related to power cycling reliability by a factor of 2. The base-plate measures only 7 cm x 13.5 cm. A mild hybrid car with an integrated starter/ generator can generate energy when braking (“regenerative braking”) and can provide additional power for a few seconds only, for example for driveaway or overtaking.
For applications in full hybrids, HybridPACK2 offers the industry’s smallest footprint of only 9.2 cm x 20.2 cm for a 800A/600V six-pack module. This is approximately a quarter smaller than today’s current solutions. The pin-finned Aluminum Silicon Carbide (AlSiC) base plate in HybridPACK2 not only enhances thermal performance, but also increases reliability. The full hybrid engine provides energy for mid-distance driving, for example for city traffic.
Unlike many power electronic applications, the design of HEV modules requires tight coupling of subsystems in order to achieve optimal system performance for a given cost. While the overall power system architecture and the type of hybrid system design (micro, mild or full hybrid) determine the overall fuel savings compared to an equivalent conventional power train, the power electronics play a significant role in ensuring efficiency, reliability and cost-effectiveness. With its wide portfolio of products including microcontrollers, power devices and sensors, Infineon is well-positioned to analyze HEV inverters from system perspective and provide the most cost-effective solution while optimizing the performance. Compared to a combustion engine industry experts expect a micro hybrid car to save up to 5 to 10 percent of fuel, a mild hybrid car with its regenerative braking and boost functionality about 15 to 35 percent of fuel, a full hybrid car up to 40 to 60 percent of fuel.
The Infineon IGBT technology provides several advantages for applications in HEV power systems. The Trench Fieldstop process yields lower conduction losses and reduced switching losses, with the combined effect of achieving smaller size of up to 30 percent for equivalent output performance compared to alternatives. Infineon IGBTs can operate at temperatures of up to 175°C, which makes cooling easier.
To provide its customers with a full solution during development and best possible time-to-market, Infineon has engineered demonstration gate driver boards for integration with the HybridPACK for HEV inverter systems. The demo board contains driver stages, fault detection and protection circuitry.
Infineon is presenting its hybrid drives’ modules at booth #1124 at the Convergence 2006 trade show October 16-18, 2006, in Detroit, Michigan, USA.
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for automotive, industrial and multimarket sectors, for applications in communication, as well as memory products through its subsidiary Qimonda. With a global presence, Infineon operates through its subsidiaries in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2005 (ending September), the company achieved sales of Euro 6.76 billion with about 36,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com. Further information on Qimonda is available at www.qimonda.com.