Infineon Introduces and Demonstrates Cutting-Edge Fiber Optics Solutions at fibercomm 2003

Jun 24, 2003 | Market News

Munich – June 24, 2003 – Infineon is highlighting its extensive portfolio of fiber optics products and solutions at the fibercomm trade show taking place this week in Munich, June 23 - 26. The company exhibits and demonstrates in its booth (Hall B1, #450) its leading new and recently announced offerings for high-speed data, telecommunications and in-vehicle network communications. The product introductions and demonstrations will include:

  • New optical transceiver (TRX) modules that comply with the recently approved
    XFP standard. Together with Infineon’s existing XPAK modules, they
    create a one-stop shop for 10 Gbps (gigabit-per-second) optical modules.

  • "Intelligent“ small-form-factor pluggable (iSFP) TRX modules based on
    1310nm VCSEL (Vertical Cavity Surface Emitting Laser) technology with data
    rates of up to 2.5 Gbps.

  • Demonstration of a 1,32 Tbit/s switch solution based on Infineon’s parallel
    optical link devices PAROLI ® with data rates of up to 3.125 Gbps per

  • Solutions for optical access networks such as PONs (Passive Optical Networks)
    as well as Point-To-Point systems with the bi-directional single fiber
    component and transceiver family.

  • New high-speed optical discrete lasers and receiver diode devices

  • Plastic Optic Fiber (POF) converters

The announcements are summarized in this News Alert. For further information, please refer to the Web URLs, or the related Media Relations contact.

Infineon Expands its Portfolio of Optical Transceivers with Space-Saving XFP Transceiver Modules – Complete Solutions for 10-Gigabit Ethernet

Infineon is demonstrating the first member of its 10G XFP transceiver series, a family of high-performance, low-cost TRX modules for serial optical data communication applications. The new modules allow manufacturers of communication equipment to build standards-based high-bandwidth systems for 10GBE, 10GFC, SONET/SDH OC-192 applications such as switches, network interface cards and host bus adapters. The 10G XFP modules are available in a short range version (up to 300 m over multi-mode fiber) using an 850nm VCSEL (Vertical Cavity Surface Emitting Laser) and as long reach modules (up to 10 km over single-mode fiber) using a 1310 nm DFB laser.

Infineon is shipping 10 Gbps 850 nm VCSEL-based transceivers in both XFP and XPAK MSA form factors, giving its customers a single source for standards-compliant 10G optical products. The Infineon 10G XFP transceiver series modules meet all specifications of the XFP MSA (Multi-Source Agreement). Included in the modules are such features as a dual Clock and Data Recovery (CDR) function that supports trace lengths of up to 12 inches and an “intelligent” interface that gives access to module operation status information.

More information on the XFP MSA is available at Additional information about Infineon’s XFP modules can be found at

Compact iSFP Modules Enable Cost-Effective Monitoring of Optical Links

The new Infineon family of TRX modules in small-form-factor pluggable (SFP) packages offers “intelligent“ features for the monitoring of an optical link. The iSFP modules are fully compliant with the small-form-factor-pluggable (SFP) MSA standard. They provide an enhanced digital diagnostics monitoring interface, based on the SFF-8472 specification, that allows real-time access to such operating parameters as laser bias current, transmitted optical power, received optical power, internal transceiver temperature and supply voltage. The iSFP modules also feature an advanced release mechanism for easy access.

The advanced packaging and electro-optical design capabilities in Infineon’s new iSFP transceiver family result in such features as extended temperature ranges, the industry’s lowest EMI performance and best-in-class jitter performance. The iSFP TRX modules are now available for data rates up to 2.5 Gbps (1310nm VCSEL).

PAROLI 2 Devices for Higher Data Throughput

PAROLI 2 devices, the second generation of Infineon’s proven parallel optical link components, are available now. The PAROLI link consists of a transmitter and a receiver module, connected by a 12-channel fiber. The low voltage of 3.3 V and SMT design increase the benefit for new system designs that require high density and low power.

With a single-channel data rate of 3.125 Gbps and 12 channels operating in parallel, the total data throughput of the new device reaches 37.5 Gbps, a 25 percent increase compared to what was previously available. This high data throughput, coupled with a low power consumption of 1.4 W, makes PAROLI modules an ideal solution for multi-processor architectures, high-speed (Internet) switching systems, and the channeling of 10 Gbps Ethernet and SONET OC192 for short-distance interconnections, such as backplanes. Infineon will demonstrate a 40 Gbps switch solution based on PAROLI components at its fibercomm booth.

Solutions for optical access networks: The BIDI® family

The Infineon BIDI® components and transceivers (TRX) allow two-way communication over a single fiber. The single fiber concept saves overall system costs by eliminating one fiber, allowing for doubling of capacity without installing new fibers and simplifying fiber management. The BIDI®-TRX modules are based on Infineon`s bi-directional optical components (BIDI®). During the exhibition Infineon will show BIDI® components and transceivers for PONs (Passive Optical Networks) as well as Point-To-Point systems with data rates of up to 1.25 Gbps. Infineon`s BIDI® components and transceiver modules are compliant to all leading standards and ideally suited for use in various access applications, for intra-office communication between switches, cross-connects, routers and servers as well as for CCTV (Closed Circuit Television) applications in transport, traffic, and security.

New High-Speed Optical Discretes: Lasers and Receiver Diodes

Infineon expands its portfolio of optical discrete components with high-speed data rates of up to 10 Gbps for LAN, SAN and SDH/SONET applications. The high- performance fiber optical devices include a DFB laser at 1300 and a receiver diode with integrated transimpedance amplifier. These components are designed for use in standard modules according to XENPAK, XPAK, and XFP multi-sourcing agreements.

The 10 Gbps components expand Infineon’s portfolio of lasers and receiver diodes up to 2.5 Gbps, including FP and DFB lasers at 1300nm and 1550nm as well as broadband receivers for different data rates up to 2.5 Gbps. With Infineon's optical components designers can build modules and systems to meet optical data transmission requirements. Different pin-out configurations and package options provide full flexibility in system design. The optical components are based on a fully automated submount technology in hermetically sealed TO cans for highest reliability.

Infineon recently announced the availability of a VCSEL diode with a 1310 nm wavelength. Unlike the commonly used DFB and FP laser diodes which emit light from the edge, VCSELs emit light from the surface which greatly simplifies packaging and results in significant cost-savings. Infineon’s 1310nm VCSEL allows for transmission distances of up to 10 km. They are packaged in a standard IC packaging further bringing down the cost of the technology.

Plastic Optic Fiber (POF) Converters

Plastic Optic Fiber (POF) components from Infineon enable low-cost applications with the advantages of optical data transmission with data rates of a few Mbps. Infineon provides high-end transceivers for the MOST® (Media Oriented Systems Transport) multimedia fiber-optic network, optimized for automotive applications. This network design provides a low-overhead and low-cost interface for such devices as microphones and speakers. Infineon also offers SFH transmitters and receivers for simple optical data transmission with POF in industrial applications. Available are red LED transmitters and photodiodes, phototransistors and integrated solutions (TTL-compatible) as receiver. The SFH components are fully integrated and assembled with connectors.

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2002 (ending September), the company achieved sales of Euro 5.21 billion with about 30,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at

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Press Photos

  • PAROLI®2-Receivers (pluggable). Infineon Technologies Parallel Optical Link with Low Voltage Differential Interface (LVDS) or with Differential Current Mode Logic (CML)
    PAROLI®2-Receivers (pluggable). Infineon Technologies Parallel Optical Link with Low Voltage Differential Interface (LVDS) or with Differential Current Mode Logic (CML)

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  • PAROLI®2 -Transmitters (pluggable). Infineon Technologies Parallel Optical Link with Multistandard Electrical Interface
    PAROLI®2 -Transmitters (pluggable). Infineon Technologies Parallel Optical Link with Multistandard Electrical Interface
    PAROLI®2 - Transmitters

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    PAROLI®2 - Transmitters

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