Infineon announces Next Generation Wireless Platform Architecture

Feb 19, 2002 | Market News

Cannes, February 19, 2002 – Infineon Technologies launched its Next Generation Wireless Platform Architecture which will drive the proliferation of wireless multimedia communication products. The unified architecture will create the basis for 2G, 2.5G and 3G terminal products, provide scalable support for mobile applications, offer an open application software interface and enable flexibly customized terminal solutions.

Infineon’s Next Generation Wireless Platform Architecture is a unified system-level platform covering hardware and software as well as access and applications technologies. The platform is open in terms of software interfaces and APIs, as well as scalable and modular to allow rapid and „right first time“ delivery of products tailored to specific market segments and specific customer needs.

Infineon’s Next Generation Wireless Platform Architecture will include a Wireless Computing Engine with baseband support for GSM/GPRS/EGPRS/UMTS and scalable application performance based on an ARM™ 926-CPU. Additional hardware components of the architecture include an Air Interface Unit and power management. The modular and scalable software architecture comprises protocol stacks, system services, operating systems and an open interface to application software. A development platform for customer system software will be available in Q4 2002.

“Infineon’s unified Next Generation Wireless Platform will permit customers to flexibly address the increasingly diversifying market segments,” said Ulrich Hamann, Chief Executive Officer of the Business Group Wireless Solutions at Infineon Technologies. “Both, scalability and durability of the architecture are an essential basis for individualized communications products and will enable fast time to market.”

The introduction of GPRS and 3G into the wireless market initiates an important transition for the wireless industry. GPRS, and 3G even more so, are expected to ignite the evolution of a wide variety of terminal classes from relatively basic terminals to high-end multimedia-enabled terminals. This will lead to an increased degree of segmentation and diversification of end user markets.

It is this anticipated increase in segmentation of the markets that creates for both the established players and for new entrants a strong need for a unified and flexibly scalable platform that serves as a durable basis for application and device developers. Applications once written are supposed to be forward and backward compatible, and largely independent of the underlying modem technology as well as the specific device implementation. This is of eminent importance to permit prolific development of a broad set of terminals and applications.

This concept is based on Infineon’s experience derived from the existing 3G program. Infineon showed its 3G experience in Cannes with a live demonstration of the predecessor of its wireless computing engine. Infineon’s 3G RF solutions are today supplied to FOMA (Freedom of Multimedia Access) terminal products in Japan. Sampling of highly integrated UMTS transceiver components has already started.

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and customized solutions for applications in the wired and wireless communications markets, for security systems and smartcards, for the automotive and industrial sectors, as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2001 (ending September), the company achieved sales of Euro 5.67 billion with about 33,800 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at

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