Infineon Introduces 4-Line T1/E1/J1 Framer and LIU Component with Smallest Footprint and Lowest Power Consumption

Jul 15, 2002 | Market News

Munich, Germany – July 15, 2002 -- Infineon Technologies (NYSE: IFX), a leading provider of integrated circuits (ICs) for advanced communication systems, today introduced QuadFALC V2, the latest member of its T1/E1/J1 Framer and LIU (Line Interface Unit) Component (FALC) family of products. Packaged in a 15mm x 15mm Plastic-Ball Grid Array (P-BGA160) and featuring power consumption of less than 180 mW per channel, QuadFALC V2 enables telecommunications equipment manufacturers to improve the integration and cost-effectiveness of all systems supporting T1/E1/J1 class data rates.

The Infineon QuadFALC provides the optimal E1/T1/J1 interface solution for wireless base stations, Frame Relay and ATM gateways, Voice over DSL and Voice over IP gateways, Channel & Data service units, Internet access equipment, LAN/WAN routers, remote access concentrators, digital access cross-connect and digital loop carrier systems. The QuadFALC builds on Infineon’s long-term commitment to the T/E equipment market, a commitment that led Gartner Dataquest to name the company in a May 2002 report as the second largest worldwide vendor of T/E carrier application-specific semiconductors in the year 2001, climbing from fourth place in the year 2000.

“According to the Gartner Dataquest forecast the long-time T/E industry represents a market of several millions of new ports annually,” said Christian Wolff, Vice President of Infineon’s Wireline Communications Business Group and General Manager of the Access Business Unit. “To enable this market to fully leverage advances in chip integration and process technology, we’ve used a 0.18 micron chip making process to achieve exceptional integration and low-power performance. QuadFALC V2 requires 30 percent less board space compared to competing solutions and offers the industry’s lowest power consumption. It will enable equipment providers to design high performance multi-channel solutions at a very attractive price,” added Wolff.

About QuadFALC

As a single chip device with very low power dissipation, the QuadFALC provides enhanced board reliability compared with alternative solutions. The ability to operate from any available clock source in the range of 1 to 20MHz, and to be software switched between T1/J1 and E1 operation, allows for the design of a single interface to all three of the worldwide Primary Rate standards, with the minimum number of components. QuadFALC V2’s PBGA-160 package has a 1.0mm ball pitch, which minimizes circuit board complexity. The highly compact device retains all of the features of the QuadFALC V1, which was packaged in larger TQFP-144, but it now offers the smallest footprint (225mm2) on the market. For example on a 32-channel line card, the QuadFALC would require only 1800mm2 of board space. Competitive solutions start at 2600mm2. The new QuadFALC can be operated from a single 3.3V power supply, which allows for pin for pin replacement of previous QuadFALC versions, or, in a new even lower power mode, from separate 3.3V and 1.8V supplies. It is designed to meet both the short-haul and long-haul requirements of T1/J1 and E1. To allow a smooth transition from the QuadFALC V1, a pin compatible TQFP-144 version also is available.

Pricing and Availability

Engineering samples of the QuadFALC V2 (PEF22554E) packaged in a 15mm x 15mm PBGA160 with a 1.0mm ball pitch are now available. The PEF22554HT device is packaged in a 20mm x 20mm TQFP144 with a 0.5mm pin pitch. Both devices operate over the –40degC to +85degC temperature range, and will be priced at less than $35 for high volumes.

The QuadFALC is supported by the EASY22554 evaluation kit. The kit includes a fully operational evaluation platform and a CD-ROM containing a PC based graphical user interface and device driver code, as well as a complete set of documentation. A complete set of data sheets and application notes is available on Infineon’s web site

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for applications in the wired and wireless communications markets, for security systems and smartcards, for the automotive and industrial sectors, as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2001 (ending September), the company achieved sales of Euro 5.67 billion with about 33,800 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at

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  • Infineon Introduces 4-Line T1/E1/J1 Framer and LIU Component with Smallest Footprint and Lowest Power Consumption
    Infineon Introduces 4-Line T1/E1/J1 Framer and LIU Component with Smallest Footprint and Lowest Power Consumption
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