Welcome to Siltectra GmbH

Based in Dresden, Siltectra GmbH is a hidden champion of the German high-tech industry. Founded as a start-up in 2010, we are driven by a clear mission: to make material utilization more efficient and sustainable. At the core of our innovation is the Cold Split Process, a laser-based separation technology that enables semiconductor materials to be split with minimal material loss. This groundbreaking approach has the potential to revolutionize semiconductor wafer manufacturing while reducing material consumption by up to 50%.

Our journey

Between 2010 and 2013, a small team successfully developed the Cold Split technology for a variety of target applications, primarily within the semiconductor materials sector. In 2013, silicon carbide (SiC) became the company's strategic focus, largely due to the significant cost-saving potential associated with this valuable semiconductor material.

Over the following years, Siltectra developed the first tools capable of enabling a complete Cold Split process. Through continuous innovation and technological advancement (including the implementation of a nitrogen-powered system) the team successfully demonstrated wafer splitting with exceptionally low material loss.

From an early stage, investors recognized the company's extraordinary potential. Their support extended far beyond financial backing, as they also guided Siltectra through critical phases of technological development and growth. This strong partnership enabled the start-up to advance its pioneering technologies with determination and consistency.

A major milestone was reached in November 2018 when Infineon Technologies AG acquired the silicon carbide specialist for approximately €124 million. The acquisition underscored the exceptional technological capabilities of Siltectra and the strong prospects of its innovations.

Following the acquisition, Siltectra became fully integrated into Infineon and focused on optimizing processes and equipment for wafer twinning (wafer separation) and boule splitting to support the production of in-house wafers. In November 2021, the technology successfully achieved qualification for high-volume manufacturing within the Infineon Group. From the outset, operations demonstrated the capability to perform several hundred wafer splits per week in a multi-shift production environment.

In 2023, Siltectra celebrated its relocation to a new facility in southern Dresden, directly connected to the Innovation Center in Coschütz. The new site provides significantly enhanced opportunities for research and development, enabling the company to further expand its technological leadership and pursue ambitious new projects for the future.

Our team

Our team consists of tailored competencies in the fields of mechanical engineering, laser technology, process development, maintenance & operations, as well as chemistry, physics, and robotics. These are supported by colleagues from quality management and other support functions.

The team develops innovative solutions and manufactures productive material in the form of 8" and (in the future) 12" wafers. Our main technological competencies include laser technology, grinding, polymer applications, automation and the optimization of both processes and equipment across our wide-ranging tool portfolio.

Our core competencies

Our core competency is based on Cold Split technology for the manufacturing/separation of semiconductor wafers from crystal ingots. Our team possesses in-depth experience in laser material processing of all common semiconductor materials. Our focus lies in applying Cold Split technology for the provision of silicon carbide wafers (SiC) from crystal ingots (boules) from a wide variety of manufacturers. Due to our process chain, we also have specialized knowledge in cryogenic and polymer technology. Through our innovative, laser-based splitting technology, we are able to replace the conventional sawing process for SiC. Through reduced material loss, higher throughput and more precise process control, we achieve greater cost efficiency, which is particularly evident with larger substrates. In addition to our technological competency, we rely on innovative automation solutions and sustainable production to further optimize our processes while operating in an environmentally friendly manner. Our mobile cobot (for example) enables automatic machine loading overnight. Through heat recovery (50% electricity savings), specialized water treatment (90% water savings), and AI-controlled media management (additional electricity savings in the double-digit percentage range), we embody the Green Fab concept to ensure environmentally friendly and resource-efficient production.

We are proud of our capabilities and experience and are committed to collaborating as effectively as possible both internally and externally with existing cooperation partners.

Our vision

Our vision is a more efficient and sustainable SiC semiconductor industry. Through innovative processes, we aim to contribute to producing more components from less raw material in the future. We work continuously on advancing our technology and exploring new applications to shape the future of the semiconductor industry. As part of the Infineon Group, we are ideally positioned to realize our vision on a global scale.

Our location

The new site in the south of Dresden, which opened in summer 2023, provides us with ideal conditions for advancing our research and development. Our modern infrastructure, including laboratory and production facilities, cleanroom conditions, as well as office and conference rooms, enables us to carry out our work efficiently and successfully. Our site is also characterized by a high degree of energy efficiency and recycling, making it a pioneer in terms of sustainability. As an ISO 9001 certified company, we place a strong focus on environmental friendliness and sustainability. We also aim to obtain ISO 14001 certification for our environmental management in the future to further emphasize our commitment to environmental protection.

We are proud of our roots in Dresden and look forward to further expanding our work here and strengthening the region.

Siltectra building in Dresden
Siltectra building in Dresden
Siltectra building in Dresden

Contact us

We are constantly looking for partners with whom we can implement joint projects. If you are interested in our work or have any questions, please feel free to contact us. We look forward to hearing from you!

Email:            info-siltectra@infineon.com

Phone:          +49 (351) 889 56130

Impressum Siltectra GmbH

Managing Directors
Dr. Peter Friedrichs
Torsten Herrich

Address
Siltectra GmbH
Pforzheimer Straße 7a
01189 Dresden
Germany

Commercial Register at Amtsgericht Dresden HRB 28951
Taxpayer Identification Number DE812655055

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