S-COM8.4

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Product details

  • Applications
    payment
  • Contact Surface
    NiAu
  • Delivery Forms
    Tape on Reel
  • Derivatives
    Au surface, Pd surface
  • Dimensions
    11 x 8.3mm
  • ISO – Reference
    ISO 14443, ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Leading Technologies
    Coil on module
  • Pitch
    9.5 mm
  • Product Description
    dual interface module, inductive coupling, 6 CB contacts
  • Product Name
    S-COM8.4
  • Thickness
    max. 320µm
OPN
Product Status
Infineon Package
Package Name
Packing Size
Packing Type
Moisture Level
Moisture Packing
Lead-free
Halogen Free
RoHS Compliant
Infineon stock last updated:
Aug 26, 2025, 4:05 PM
The innovative ’Coil on Module’ package technology from Infineon uses a radiofrequency link rather than the common mechanical-electrical connection between the card antenna and the module, it employs two antennas, one on the module and one in the card, communicating w/o physical electrical connection.It improves the robustness of dual interface cards and simplifies card design and manufacturing, making it more efficient and faster.

Features

  • Pitch: 9.5 mm
  • Dimensions: 11 x 8.3 mm
  • Thikcness: max. 420µm
  • Contact surface NiAu
  • Derivates: Au surface, Pd surface
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Tape on Reel

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