HybridPACK™ Drive with Si and SiC technology is Infineon’s market leading power module for traction inverters of electric vehicles
HybridPACK™ Drive is a very compact power module optimized for hybrid and electric vehicles traction applications offering a scalable power range of 100kW to 250kW within the 750 V and 1200 V class. Its design allows customers to scale performance levels, with thermal stacks and different chipsets, according to their desired cost-perfomance trade-off while maintaining the same module footprint.
The HybridPACK™ Drive was first introduced in 2017, using Infineon’s silicon EDT2 technology, specifically optimized to deliver the best efficiency on a real-world driving cycle. EDT2 decreased the module's chip area by 25%, improved switching performance and made it more cost-effective than infineon's preceeding automotive power module, HybridPACK™ 2. The HybridPACK™ Drive is Infineon’s market-leading power module with a track record of close to two million pieces shipped for more than 20 electric vehicle platforms.
In 2021 Infineon introduced the new CoolSiC™ version, based on Infineon’s silicon carbide trench MOSFET structure. Compared to planar structures, the Trench enables a higher cell density, resulting in the best-in-class figure of merit. Therefore, trench MOSFETs can be operated at lower gate-oxide field strengths, resulting in increased reliability.
Currently, Infineon is working on the second generation of HybridPACK™ Drive which will be available from 2023. The HybridPACK™ Drive G2 will be a scalable product family using our next generation chipset EDT3 and CoolSiC™ G2 along with new features improving the package in many aspects and bringing additional value to the customer.
- High-performance IGBT technology with high power density and low switching losses
- Industry-standard footprint
- Broad scalable portfolio of modules for different performance classes without need for major system redesign
- Optimized cost-performance ratio