EconoPIM™ 2 & 3
汎用インバータ用統合ソリューション
EconoPACK™ 4
Rugged mechanical design with ultrasonic welded and injection-molded screw terminals
EconoPACK™ 2 & 3
Our high performance and flexible solution that fulfills high power density needs
eupec ™ EconoBRIDGE™
Our versatile rectifier stage dedicated to work with EconoPACK™ 2 & 3
EconoPACK™ 2 & 3 with shunts
Cost reduction by consistent accuracy of current measurement
EconoPACK™ +
Increasing the efficiency while gaining the lifetime and durability
EconoDUAL™ 3
First choice for highest reliability and lifetime in demanding applications

Econo IGBT Modules

Power Simulation IPOSIM

PressFIT Technology

3:00

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

Thermal Interface Material

3:03

A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

IGBT Module Finder