EconoPIM™ 2 & 3
EconoPACK™ 4
Rugged mechanical design with ultrasonic welded and injection-molded screw terminals
EconoPACK™ 2 & 3
Our high performance and flexible solution that fulfills high power density needs
eupec ™ EconoBRIDGE™
Our versatile rectifier stage dedicated to work with EconoPACK™ 2 & 3
EconoPACK™ 2 & 3 with shunts
Cost reduction by consistent accuracy of current measurement
EconoPACK™ +
Increasing the efficiency while gaining the lifetime and durability
EconoDUAL™ 3
First choice for highest reliability and lifetime in demanding applications

Econo IGBT Modules

Power Simulation IPOSIM

PressFIT Technology

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

Thermal Interface Material

A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

IGBT Module Finder