EconoPIM™ 2 & 3


EconoPACK™ 4

Rugged mechanical design with ultrasonic welded and injection-molded screw terminals

EconoPACK™ 2 & 3

Our high performance and flexible solution that fulfills high power density needs

eupec ™ EconoBRIDGE™

Our versatile rectifier stage dedicated to work with EconoPACK™ 2 & 3

EconoPACK™ 2 & 3 with shunts

Cost reduction by consistent accuracy of current measurement

EconoPACK™ +

Increasing the efficiency while gaining the lifetime and durability

EconoDUAL™ 3

First choice for highest reliability and lifetime in demanding applications

Econo IGBT Modules

Power Simulation IPOSIM

PressFIT Technology


Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

Thermal Interface Material


A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

IGBT Module Finder