FS820R08A6P2 750 V 820 A 六单元 汽車合格 IGBT模块

综述

The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The direct cooled baseplate with PinFin structure in the FS820R08A6P2 product best utilizes the implemented chipset and shows superior thermal characteristics.

特征描述

  • Blocking voltage 750V
  • Low VCEsat
  • Low Switching Losses
  • Low Qg and Cres
  • Low Inductive Design
  • Tvj op = 150°C
  • Short-time extended Operation Temperature Tvj op = 175°C

优势

  • Compact Design
  • Direct Cooled Base Plate
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
  • RoHS compliant
  • Mechanical guiding elements

潜在应用

  • Automotive Applications
  • Hybrid Electrical Vehicles (H)EV
  • Motor Drives
  • Commercial Agriculture Vehicles
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Power Simulation Tool (IPOSIM)

Infineon Online Power Simulation Tool (IPOSIM) for automotive high-power modules

  • Get to know Infineon’s IPOSIM tool, specifically for an automotive electric vehicle inverter
  • Discover the steps involved in simulating different parameters and comparing the results of different Infineon products to see which is the best fit for your application
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