汽车 IGBT 和 CoolSiC™ MOSFET 模块

通过高耐压性能和低损耗最大限度地提高效率

尽管Si IGBT仍然是汽车功率模块市场的主导技术，但强劲增长的基于SiC MOSFET的解决方案补充了我们的Si IGBT产品。 我们的 CoolSiC™ MOSFET 功率模块具有多种优势，包括更低的损耗和更高的开关频率，可实现更高的效率、更长的驱动范围或更低的整体系统成本。 它们提供更高的功率密度，并将我们的功率模块扩展到更高的功率和更低的总体系统成本。


CoolSiC™

在一系列电压等级和额定电流范围内的卓越性能

我们的 HybridPACK 和 EasyPACK™ 系列提供五种不同的封装系列（HybridPACK Drive G1 & G2、HybridPACK DSC、 EasyPACK™ , HybridPACK™ 1 and HybridPACK™ DC6i 和 HybridPACK™ 2)，涵盖硅和碳化硅技术中的各种电压等级（650 V-1200 V）和功率等级。 我们的半桥和B6桥汽车功率模块产品组合为我们客户的设计提供了最多的选择和最大的灵活性。 使用英飞凌的在线功率仿真平台 (IPOSIM)。

HybridPACK™ Drive

评估套件如何支持您的逆变器设计？

我们所有的评估套件均为开放式设计，可作为使用 HybridPACK™ 或EasyPACK™模块的应用的设计参考。 我们的主逆变器评估板使您能够在几分钟内操作基本的开环逆变器，无需任何软件或与外部控制单元进行任何通信。 无源三相电感负载和简单负载测试（DEMO-MODE）可以驱动至功率模块的最大性能。 发货内容包括包含原理图、布局和物料清单的数据源、栅极驱动板、逻辑板和接口 PCB 上的信息。 另一个可以使用我们的 EasyPACK™ 评估套件演示的应用是 HV/LV DC-DC 转换器。 该评估板以及我们高效的 EasyPACK™ 本身有助于减少充电损耗、提高电池电压和充电速度。

• Our evaluation kits are designed to support customers in their first steps in designing applications with our power modules. All of our evaluation kits are open designs. Therefore, they can be taken as a design reference for applications utilizing HybridPACK™ or EasyPACK™ modules. In addition they can help to test the electrical and thermal performance of our power modules in an example application.
• Our main inverter evalution boards enable you to operate basic open loop inverters within a few minutes and without any software or communication to external control units.
• Passive three phase inductive loads and simple load tests (DEMO-MODE) can be driven up to the maximum performance of the power modules. The shipping content includes a data source with schematics, layout and bill of material, information on the gate driver board, logic board and interface PCB. For instance,the Evaluation Kit HybridPACK™ Drive is intended to demonstrate the outstanding performance of the latest Infineon IGBT generation EDT2 combined with our latest module package HybridPACK™ Drive. One of many approaches of designing inverters with our flexible molded modules can be found in the Evaluation Kit HybridPACK™ DSC. It implements our HybridPACK™ DSC S1 or S2 and demonstrates the modules double-sided cooling concept resulting in high power density and advanced sensing & diagnostic concepts.
• Another supported application which can be demonstrated with our Evaluation Kit for EasyPACK™ is the HV/LV DC/DC Converter. The evaluation board – and our highly efficient EasyPACK™ itself – help to achieve less charging losses, increased battery voltage and charging speed.

• Samples can be ordered online once productive samples are available
• For pre-productive samples, please contact your distributor or Infineon sales office for support. Pre-productive samples are not suitable for use in vehicles on the road or for qualification purposes!

• Black samples
  –Use case: lab measurement
  –IR camera can measure chip temperature under load conditions
  –Lead time: 10 weeks ~ 6 months
  
  
• Thermocouple modules
  –Use case: lab measurement
  –Temperature sensor can measure chip temperature under load conditions
  –Lead time: 10 weeks (best case) ~ 6 months
  
  
• Please contact your distributor or Infneon sales office for ordering special samples
  
  

• Comment: HybridPACK™ Drive G2, HybridPACK™ DSC and HybridPACK™ DSC CoolSiC™ modules contain an on-chip temperature sensor which can deliver chip temperature data during lab evaluation special samples (black/thermocouple modules) are not required in this case

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• Understand how Infineon’s power semiconductor module portfolio is a solution for the main challenges of the electric vehicle industry
• Know Infineon’s general value drivers as well as recent success stories on the electromobility market

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