ESCC 5000
Infineon's ESA-qualified rad hard MOSFETs are tested to verify their high reliability with an assurance program based on the requirements outlined in ESCC-5000. Radiation hardness assurance is guaranteed by testing every manufacturing wafer-diffusion lot for total dose steady-state irradiation according to the ESCC Basic Specification No. 22900. These export regulation unclassified rad hard FETs have also been characterized in heavy ion environments for Single Event Effects (SEE) according to the ESCC Basic Specification No. 25100.
| ESCC Chart | ESCC Para. | Test/Inspection | Flight parts (ES) | Method |
| F2 - Production Control |
|
WAFER LOT ACCEPTANCE |
|
|
| 5.2.1 |
Process Monitoring Review |
100% |
|
|
| 5.2.2(a) |
Room Temperature Electrical Measurements |
100% |
|
|
| Wafer dicing |
|
|||
| 5.2.2(b) |
Die Visual Inspection |
100% |
ESCC Basic Specification 20400 |
|
| 5.2.3 |
Die Dimensions (Note 1) |
|
||
| 5.2.4 |
SEM Inspection |
sample |
ESCC Basic Specification 21400 |
|
| 5.2.5 |
Total Dose Radiation Testing |
sample |
ESCC Basic Specification 22900 |
|
| SPECIAL IN-PROCESS CONTROLS |
|
|||
| Assembly |
|
|||
| 5.3.2 |
Internal Visual Inspection (precap) |
100% |
ESCC Basic Specification 20400 |
|
| 5.3.3 |
Bond Strength |
sample |
MIL-STD-750, Test Method 2037, Condition C or D |
|
| 5.3.3 |
Die Shear |
sample |
MIL-STD-750, Test Method 2017 |
|
| Encapsulation |
|
|||
| 5.3.4 |
Dimension Check |
sample |
ESCC Basic Specification 20500 |
|
| 5.3.5 |
Weight (Note 1) |
|
Note 1 – guaranteed but not tested
| ESCC Chart | ESCC Para. | Test/Inspection | Flight parts (ES) | Method |
| F3 – Screening Tests |
6.1 |
Serialisation |
100% |
|
| 8.7 |
Verification of Safe Operating Area / Thermal impedance / Delta VSD (Note 1) |
100% |
MIL-STD-750, Test Method 3161 |
|
| 8.8 |
High Temperature Stabilisation Bake |
100% |
MIL-STD-750, Test Method 1032 |
|
| 8.9.1 |
Temperature Cycling (Note 1) |
100% |
MIL-STD-883, Test Method 1010, Condition C, 20 cycles |
|
| 8.10 |
Particle Impact Noise Detection (PIND) |
100% |
MIL-STD-750, Test Method 2052, Condition A |
|
| 8.1.3 |
Parameter Drift Values (Initial Measurements) |
100% |
|
|
| 8.11 |
High Temperature Reverse Bias Burn-in |
100% |
MIL-STD-750, Test Method 1042, Condition A, 240h |
|
| 8.1.3 |
Parameter Drift Values (Final Measurements for HTRB Burn-in; |
100% |
|
|
| 8.12 |
Power Burn-In / High Temperature Steady-State Gate Bias (Note 1) |
100% |
MIL-STD-750, Test Method 1042, Condition B, 48h |
|
| 8.1.3 |
Parameter Drift Values (Final Measurements) |
100% |
|
|
| 8.1.2 |
High and Low Temperatures Electrical Measurements |
sample |
|
|
| 8.1.1.2 |
Room Temperature Electrical Measurements |
100% |
|
|
| 6.4.1 |
Check for Lot Failure |
100% |
|
|
| 8.13 |
Case Isolation |
100% |
MIL-STD-750, Test Method 1081 |
|
| 8.14 |
Radiographic Inspection (Note 1) |
n.a. |
ESCC Basic Specification 20900 |
|
| 8.15 |
Seal (Fine Leak) (Note 1) |
100% |
MIL-STD-883, Test Method 1014, Condition A1 or A2 |
|
| 8.15 |
Seal (Gross Leak) |
100% |
MIL-STD-750, Test Method 1071, Condition C |
|
| 8.6 |
External Visual Inspection |
100% |
ESCC Basic Specification 20500 |
|
| 8.16 |
Solderability (Note 2) |
n.a. |
MIL-STD-750, Test Method 2026 |
Note 1 – deviation from ESCC 5000 agreed with the ESCC Executive. See. ESCC Detail Specification
Note 2 – not applicable unless otherwise stipulated in the Purchase Order
| ESCC Chart | ESCC Para. | Test/Inspection | Min. quanitity | Method |
| F4 – Qualification, Periodic Testing and Lot Validation Testing for Packaged Components |
|
ENVIRONMENTAL/MECHANICAL SUBGROUP (24 Months Period) |
||
| 8.9.2 |
Temperature Cycling (Note 1) |
15 |
MIL-STD-883, Test Method 1010, Condition C, 100 cycles |
|
| 8.21 |
Moisture Resistance |
15 |
MIL-STD-750, Test Method 1021 |
|
| 8.15 |
Seal (Fine Leak) (Note 1) |
15 |
MIL-STD-883, Test Method 1014, Condition A1 or A2 |
|
| 8.15 |
Seal (Gross Leak) |
15 |
MIL-STD-750, Test Method 1071, Condition C |
|
| 8.1.4 |
Intermediate and End-Point Electrical Measurements |
15 |
|
|
| 8.6 |
External Visual Inspection |
15 |
ESCC Basic Specification 20500 |
|
| 8.17 |
Mechanical Shock |
15 |
MIL-STD-750, Test Method 2016, 1500g, 0.5ms duration, 5 shocks, planes X1, Y1 and Z1 |
|
| 8.18 |
Vibration |
15 |
MIL-STD-750, Test Method 2056, 20g, 10-2000Hz, cross over at 50Hz |
|
| 8.19 |
Constant Acceleration |
15 |
MIL-STD-750, Test Method 2006, 20000g, planes X1, Y1 and Y2 |
|
| 8.15 |
Seal (Fine Leak) (Note 1) |
15 |
MIL-STD-883, Test Method 1014, Condition A1 or A2 |
|
| 8.15 |
Seal (Gross Leak) |
15 |
MIL-STD-750, Test Method 1071, Condition C |
|
| 8.1.4 |
Intermediate and End-Point Electrical Measurements |
15 |
|
|
| 8.6 |
External Visual Inspection |
15 |
ESCC Basic Specification 20500 |
|
| ENDURANCE SUBGROUP (12 Months Period) |
||||
| 8.22 |
Operating Life 2000 Hours |
15 |
MIL-STD-883, Test Method 1014, Condition A1 or A2 |
|
| 8.1.4 |
Intermediate and End-Point Electrical Measurements |
15 |
MIL-STD-750, Test Method 1071, Condition C |
|
| 8.15 |
Seal (Fine Leak) (Note 1) |
15 |
ESCC Basic Specification 20500 |
|
| 8.15 |
Seal (Gross Leak) |
15 |
MIL-STD-750, Test Method 2026 |
|
| 8.6 |
External Visual Inspection |
|
|
|
|
|
ASSEMBLY CAPABILITY SUBGROUP (24 Months Period) |
|||
| 8.23 |
Permanence of Marking (Note 2) |
n.a. |
ESCC Basic Specification 24800 |
|
| 8.24 |
Terminal Strength |
5 |
MIL-STD-750, Test Method 2036 |
|
| 8.2 |
Internal Visual Inspection |
5 |
ESCC Basic Specification 20400 |
|
| 8.5.1 |
Bond Strength |
5 |
MIL-STD-750, Test Method 2037, Condition C or D. |
|
| 8.5.2 |
Die Shear |
5 |
MIL-STD-750, Test Method 2017 |
|
Note 1 – deviation from ESCC 5000 agreed with the ESCC Executive. See. ESCC Detail Specification
Note 2 – not applicable due to laser marking
