增强现实与数字世界的连接CYW20819
AIROC™ CYW20819蓝牙®和低功耗蓝牙®片上系统
The AIROC™ CYW20819 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.2 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20819 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.
The AIROC™ CYW20819 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application.
AIROC™ CYW20819 Modules
Infineon's AIROC™ CYW20819 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20819 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYBT-213043-02, CYBT-223058-02, CYBT-263064-02, CYBT-263065-02, CYBT-273063-02 are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.
- 最高速度达到96 MHz的强大的Arm® Cortex®-M4内核
- ROM中的蓝牙协议栈支持无需任何外部微控制器的单机模式
- 256-KB片上闪存
- 176-KB片上RAM
- 蓝牙协议栈、外设驱动器和安全功能被内置到ROM（1 MB）中，允许应用程序高效地使用片上闪存
- AES-128和真随机数生成器（TRNG）
- ROM中的安全功能，包括ECDSA签名验证
- 空中（OTA）固件更新
- 符合2版蓝牙核心规范
- 支持BR、EDR 2 Mbps和3 Mbps、 eSCO、Bluetooth LE和LE 2 Mbps
- 高达+4 dBm的可编程发射功率
- 卓越的接收器灵敏度（Bluetooth LE 1 Mbps：-95 dBm）
- 高达22个GPIO
- I²C、UART和PCM接口
- 两个四线SPI接口
- 拥有最多28个模拟通道的辅助ADC
- 可编程按键扫描20 x 8矩阵
- 三轴正交信号解码器
- 通用计时器和PWM
- 实时时钟（RTC）和监视计时器（WDT）
