Plastic Green (PG) Ball Grid Array Package (BGA)

Ball Grid Array (BGA) packages with a multilayer glass woven epoxy substrate. The terminations consist of lead-free solder balls that allow for Surface Mount Technology (SMT) assembly. Our square plastic green (PG) ball grid array packages (BGA) are also available as a Low-profile Fine-pitch BGA (LFBGA) variant with smaller body size and lower I/O counts.

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Package Type	Tray	Tape & Reel
PG-BGA-119-801
PG-BGA-119-802
PG-BGA-119-803	1	1
PG-BGA-165-804	1	1
PG-BGA-165-805	1	1
PG-BGA-165-806	1
PG-BGA-165-807
PG-BGA-172-802
PG-BGA-172-803	1
PG-BGA-209-801	1
PG-BGA-24-800	1
PG-BGA-24-801
PG-BGA-24-802	1
PG-BGA-24-803		1
PG-BGA-24-804	1
PG-BGA-24-805	1
PG-BGA-256-802	1
PG-BGA-256-803
PG-BGA-416-22	1	1
PG-BGA-416-24		1
PG-BGA-416-26		1
PG-BGA-416-29		1
PG-BGA-416-800	1
PG-BGA-484-801	1
PG-BGA-49-800	1