HybridPACK™ Drive

HybridPACK™ Drive with Si and SiC technology is Infineon’s market-leading power module for traction inverters of electric vehicles

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Overview

HybridPACK™ Drive offers a compact and scalable power solution for hybrid and electric vehicle traction, ranging from 100 kW to 300 kW, within 750 V and 1200 V classes. It allows performance scaling with thermal stacks and chipsets, maintaining the same module footprint.

Key Features

  • Best-in-class Si and SiC technology
  • Benchmark performance and efficiency
  • Industry standard footprint
  • Scalability and ease of design
  • AQG324 automotive qualification

Products

About

HybridPACK™ Drive with best-in-class IGBT and SiC technology

The HybridPACK™ Drive was first introduced in 2017, using Infineon’s silicon EDT2 technology, specifically optimized to deliver the best efficiency on a real-world driving cycle. In 2021 Infineon introduced the new CoolSiC™ version, based on Infineon’s silicon carbide trench MOSFET structure. Compared to planar structures, the Trench enables a higher cell density, resulting in the best-in-class figure of merit.

More about CoolSiC™
Next generation EDT3 and CoolSiC™  G2 technology

In 2023, Infineon introduced the second generation of the power module: the HybridPACK™ Drive G2, featuring advanced EDT3 IGBT and CoolSiC™ G2 MOSFET chip technologies. With a power range of up to 300 kW, the HybridPACK™  Drive G2 provides higher ease-of-use and new features compared to its previous generation, such as an integration option for next-generation phase current sensor and on-chip temperature sensing for IGBT products, which enable system cost improvements. It also delivers higher performance and power density thanks to improved assembly and interconnect technology. By 2025, the HybridPACK™ Drive G2 portfolio will expand to include different current ratings and voltage levels (750 V and 1200 V).

What are the benefits of Infineon's HybridPACK™ Drive G1 and G2?
  • Most scalable power portfolio in the market with IGBT and CoolSiC™ options in 1200 V and 750 V for various power classes, without need for major system redesign
  • HybridPACK™ Drive G1: EDT2 and CoolSiC™ chipset with high power density and soft switching behavior for ease of design for traction inverters in EVs
  • HybridPACK™ Drive G2 continuing the success: EDT3 and CoolSiC™ G2 technology with new benchmark performance and efficiency for improved cost/performance ratio
  • Full automotive qualification AQG324

HybridPACK™ Drive with best-in-class IGBT and SiC technology

The HybridPACK™ Drive was first introduced in 2017, using Infineon’s silicon EDT2 technology, specifically optimized to deliver the best efficiency on a real-world driving cycle. In 2021 Infineon introduced the new CoolSiC™ version, based on Infineon’s silicon carbide trench MOSFET structure. Compared to planar structures, the Trench enables a higher cell density, resulting in the best-in-class figure of merit.

More about CoolSiC™

Next generation EDT3 and CoolSiC™  G2 technology

In 2023, Infineon introduced the second generation of the power module: the HybridPACK™ Drive G2, featuring advanced EDT3 IGBT and CoolSiC™ G2 MOSFET chip technologies. With a power range of up to 300 kW, the HybridPACK™  Drive G2 provides higher ease-of-use and new features compared to its previous generation, such as an integration option for next-generation phase current sensor and on-chip temperature sensing for IGBT products, which enable system cost improvements. It also delivers higher performance and power density thanks to improved assembly and interconnect technology. By 2025, the HybridPACK™ Drive G2 portfolio will expand to include different current ratings and voltage levels (750 V and 1200 V).

What are the benefits of Infineon's HybridPACK™ Drive G1 and G2?
  • Most scalable power portfolio in the market with IGBT and CoolSiC™ options in 1200 V and 750 V for various power classes, without need for major system redesign
  • HybridPACK™ Drive G1: EDT2 and CoolSiC™ chipset with high power density and soft switching behavior for ease of design for traction inverters in EVs
  • HybridPACK™ Drive G2 continuing the success: EDT3 and CoolSiC™ G2 technology with new benchmark performance and efficiency for improved cost/performance ratio
  • Full automotive qualification AQG324

Documents

Documents

Design resources

Developer community

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