With the MFC6.x product series Infineon offers black lined premium Flip Chip packages with an quivalent appearance like epoxy tape. In combination with an optimized card cavtiy this products offer advantages for mechanical robustness, module flatness in card and improved image of card backside in area of module milling cavity. For the Payment market this products are also availabel with palladium surface.
- 13 x 11.8mm
- max. 470µm
- ISO 7816-1, ISO 7810, ISO 10373-1/-3
- Au surface, Pd surface, S-MFC6.8-8-1, S-MFC6.8-8-3
- Tape on Reel
- EMV SDA/DDA,
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