Application Notes

Assembly Instructions EconoPACK™4 ModulesShare
02_00 | Feb 01, 2013 | PDF | 898 kb
Evaluation Adapter Board for EconoPACK™ 4 3-Level Modules in NPC2-TopologyShare
Jul 14, 2014 | PDF | 1.47 mb
F3L2020E07-F-P Evaluation Driver Board for EconoPACK™4 3-Level Modules in NPC2-Topology with 1ED020I12-F gate driver ICShare
Mar 21, 2014 | PDF | 1.15 mb
F3L2020E12-F-P Evaluation Driver Board for EconoPACK™ 4 3-Level Modules in NPC2-Topology with 1ED020I12-F gate driver ICShare
01_01 | Feb 21, 2014 | PDF | 1.01 mb
Industrial IGBT Modules Explanation of Technical InformationShare
01_02 | Nov 03, 2015 | PDF | 2.25 mb
Mounting instruction for PressFIT with forked pinsShare
02_01 | Jul 01, 2016 | PDF | 1.1 mb
Soldering of Econo and Easy ModulesShare
01_00 | Aug 15, 2005 | PDF | 192 kb
Using the NTC inside a power moduleShare
01_00 | Nov 13, 2009 | PDF | 290 kb
Definition of Junction TemperatureShare
01_00 | Jan 09, 2008 | PDF | 83 kb
Modules with pre-applied Thermal interface MaterialShare
02_01 | Jan 13, 2017 | PDF | 427 kb

Editorials

Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesShare
01_00 | Nov 04, 2015 | PDF | 298 kb
Thermal Management Details and their Influence on the Aging of Power SemiconductorsShare
Aug 28, 2014 | PDF | 915 kb
IGBT Module technology state of the art and future evolutionsShare
Feb 07, 2014 | PDF | 38 kb
The challenge of accurately analyzing thermal resistancesShare
May 31, 2014 | PDF | 1.06 mb
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesShare
May 31, 2014 | PDF | 705 kb
The challenge of accurately analyzing thermal resistancesShare
May 31, 2014 | PDF | 1.06 mb
Superior thermal stability by enhanced base plate design combined with dedicated Thermal Interface MaterialShare
Jun 27, 2013 | PDF | 1.65 mb
PressFIT Technology, a Solderless Method for Mounting Power ModulesShare
01_00 | Jan 24, 2006 | PDF | 377 kb
Thermal Interface - A Key Factor in Improving Lifetime in Power ElectronicsShare
May 31, 2012 | PDF | 310 kb
Optimizing Thermal Interface Material for the Specific Needs of Power ElectronicsShare
May 31, 2012 | PDF | 518 kb
The Challenging Task of Thermal ManagementShare
May 31, 2011 | PDF | 937 kb
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current ModulesShare
Feb 07, 2014 | PDF | 141 kb
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?Share
Jan 31, 2011 | PDF | 732 kb