IPAK Short Lead with ISO Standoff
Solution for higher assembly yield in charger applications
The IPAK Short Lead (SL) with ISO Standoff package in combination with CoolMOS™ CE was introduced in 2016 to address assembly challenges in charger applications. Now, Infineon is enabling its customers to also enjoy the benefits of its latest superjunction MOSFET technology, the CoolMOS™ P7, in combination with this package solution. CoolMOS™ P7 is designed for competitiveness in the low power SMPS market, by offering an excellent price/performance ratio and ease-of-use, making it a perfect fit for its target applications.
IPAK SL is the preferred package in charger applications as it can be fully inserted into the PCB during assembly, which helps to meet charger height requirements. However, this often leaves residues between the package body and PCB region after the post-assembly cleaning. These residues cause yield losses and thus need to be addressed with additional process steps and increasing cost.
The Infineon IPAK Short Lead with ISO Standoff package offers a well defined mold feature at the bottom of the package body: it allows to fully insert the MOSFET into the PCB while still having a well-defined isolation distance of 0.37 mm (maximum value) between PCB and package body. This way, the residues between package and PCB can be effectively removed after cleaning, which improves yield and reduces cost. This feature also helps to increase the effective creepage distance between the legs. In addition, the optimized leg width and length make this package more suitable for charger applications.
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