Infineon's TO-Leadless package is optimized for high current applications such as forklift, light electric vehicles (LEV), POL (point-of-load) and telecom. This package is a perfect solution for high power applications where highest efficiency, outstanding EMI behaviour as well as best thermal behaviour and space reduction are required.
- Industry‘s lowest R DS(on)
- Highest current capability up to 300A
- Very low package parasitics and inductances
- Less paralleling and cooling required
- Highest system reliability
- System cost reduction
- Enabling very compact design
- Light electric vehicles (LEV) e.g. e-scooter, e-bikes or µ-car
- Point-of-load (POL)
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