TOLT

TOLT - The TO-Leadless top side cooling package for superior thermal performance 

If you are looking for better heat dissipation, OptiMOS™ power MOSFET in TOLT is the solution. 

Infineon’s OptiMOS™ power MOSFET family expands its high performance package offerings with the introduction of the TO-Leadless top-side cooling (TOLT) package to its portfolio. The TOLT package offers the same high current low profile benefits as the TOLL package with the additional advantage of top-side cooling for optimum thermal performance. 

This innovative package combined with the key features of OptiMOS™ 5 power MOSFET technology enables best-in-class products in 80V and 100V as well as high current rating >300A for high power density designs. 

How do you benefit from TOLT? 

With top-side cooling, the drain is exposed at the surface of the package allowing for 95 percent of the heat to be dissipated directly to the heatsink, achieving 20% better R_thJA and 50 percent improved R_thJC compared to the TOLL package. With bottom-side cooling packages, like the TOLL or the D²PAK, the heat is dissipated via the PCB to the heatsink resulting in high power losses. 

The OptiMOS™ 5 power MOSFETs in TOLT are targeted at applications seeking high thermal performance such as e-scooter, LEV - light electric vehicles, power tools and battery management systems.