OptiMOS™ power MOSFETs in TOLG package - the package for higher thermal cycling on board performance
Infineon’s OptiMOS™ power MOSFET high performance packages family: The TO-Leadless Gullwing (TOLG)
This package offers the same high current and low profile features as the TO-Leadless (TOLL). The TOLG is compatible with the footprint to the TO-Leadless with the additional feature of gullwing leads for high thermal cycling.
The TOLG allows excellent electrical performance compared to D2PAK 7-pin with ~60 percent board space reduction. This package offers very low RDS(on) and is optimized to handle high currents >300A.
Thanks to the flexibility of gullwing leads, the OptiMOS™ family of MOSFETs in the TOLG package features excellent solder joint reliability on aluminum insulated metal substrate boards (Al-IMS). This results in 2x higher thermal cycling on board (TCoB) compared to the standard requirements (IPC-9701).
Key benefits of the TOLG include high efficiency, lower EMI as well as high power density enabling high performance and overall system efficiency.
The OptiMOS™ power MOSFET family in the TOLG package is available in a broad portfolio of voltages including 60V, 80V, 100V, 200V and 250V. Target applications include: e-scooter, (LEV) light electric vehicles, power tools and battery management system applications.
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