The well-known market leading IHV 4.5 kV IGBT3 modules have now been upgraded to the latest front- and backend technologies and design possibilities. The FZ1800R45HL4(_S7) feature the latest 4.5 kV chip generation in 8” wafer technology and are the perfect fit for Transmission & Distribution as well as industrial drives. An upgrade from older chip generations is feasible thanks to the standardized IHV B package of 190 x 140 mm.
Both modules can realize 50% higher output power at the same size, which in turn means cost-reduction for the system designer. For example the FZ1800R45HL4 is the first module to enable 1.4 GW HVDC Plants at 320 kV without paralleling. FZ1800R45HL4_S7, in addition, can be driven by applying a gate voltage of 25 V instead of the usual 15 V.
Over 100k pieces of IHV B 4500 V with IGBT3 are the reliable workhorses enabling a stable green grid, now the new FZ1800R45HL4(_S7) will follow this heritage with even lower losses.