- Extended operation temperature (vj op= 175°C)
- Output current increased by more than 25% in the same footprint
- Copper Bonds for high current carrying capabilities
- Sintering of chips for highest power cycling capabilities
- Total losses reduced by up to 20%
- Package with CTI > 400
- Pre-applied Thermal Interface Material
- Increase in power density by up to 25%
- Up to 10 times longer lifetime
- Less cooling effort for same output power
- Enables higher system overload conditions
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