FF1000R17IE4P 1700 V 1000 A デュアル IGBTモジュール

概要

PrimePACK™3 1700 V, 1000 A half bridge dual IGBT module with TRENCHSTOP™ IGBT4, NTC and fast switching chip. Pre- applied with Thermal Interface Material.

特長

  • Extended operation temperature Tvj op
  • High DC stability
  • High current density
  • Low switching losses
  • Tvj op = 150°C
  • Low VCEsat
  • Package with CTI > 400
  • High creepage and clearance distances
  • High power and thermal cycling capability
  • Copper base plate
  • UL recognized

利点

  • High power density
  • Standardized housing
図
ビデオ
Share
サポート