Latest Discrete Packages

概要

最新のディスクリートIGBT用TO-247 4ピン ケルビンエミッタパッケージ

最新の TO-247 4ピン ケルビンエミッタパッケージは、高効率を求められるアプリケーションにおいて、電力密度の向上とスペースの節約という要求に応えるものです。また、大電力アプリケーション用の新しい TO-247PLUSパッケージでは、120A以下のIGBTと定格電流値のダイオードをJEDEC標準TO-247と同じフットプリント、同じピン配列に1パッケージ化することが可能になります。

詳細

TRENCHSTOP™ Advanced Isolation

The TRENCHSTOP™ Advanced Isolation represent the cutting-edge technology in isolated packages. 35% lower thermal resistance R th(j-h) of advance isolation material compared to high grade Iso-foil enables effective and reliable thermal path from chip to the heatsink.

S5 TRENCHSTOP™ 5 in TO-247 4pin

Highest efficiency at medium speed switching from 10 kHz to 40 kHz with 50 A and 75 A S5 650 V TRENCHSTOP™5 IGBT in TO-247 4pin Kelvin Emitter package.

TO-247PLUS 3pin for 1200 V IGBT

Bigger active chip area of the TO-247PLUS package can accommodate up to 75 A IGBT with 75 A diode in TO-247 footprint. Higher power density of TO-247PLUS can be used to reduce paralleling, increase system power density or system power output.

TO-247PLUS 4pin for 1200 V IGBT

The 4th pin know as Kelvin emitter terminal, bypasses the emitter lead inductance on the gate control loop, enhancing the IGBT’s switching speed and decreasing the switching energy.

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推奨ドキュメント

シミュレーション
ビデオ
3:23

TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board - Board Description And Purpose

This video gives a general introduction of the TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board. It explains the main features and components as well as the delivery scope.

TRENCHSTOP™ 5 in TO-247 4pin Package - Portfolio Overview

3:24

This video will provide you information about the best in class performance of the TRENCHSTOP™ 5 IGBT technology. Infineon offers the technology in a high power package with an extra Kelvin Emitter pin. The standard TO-247 package body has been taken and an extra, 4th pin, has been added to enable the Kelvin Sense configuration.

Discrete IGBT in TO-247PLUS Target Applications

1:53

TO-247PLUS discrete IGBT can be used to increase the power density of the design, increasing system nominal current. 100A or 120A are possible to improve thermal conditions - reducing junction temperature - up to 25% Tcase reduction as lower cost alternative to IGBT modules - up 50% component cost reduction.

Discrete IGBT in TO-247PLUS Features and Benefits

2:33

TO-247PLUS package has the same dimensions as standard TO-247, but accomodates as much as 100A and 120A duopack IGBT can. Due to bigger thermal pad area the TO-247PLUS package has lower package thermal resistance, better heat dissipation capabilities. The TO-247PLUS allows around 25% thermal performance improvement compared to standard TO-247.

Discrete IGBT in TO-247PLUS

3:22

Technical Discription and Performance Part 1

Discrete IGBT in TO-247PLUS

4:05

Technical Discription and Performance Part 2

Discrete IGBT in TO-247PLUS

2:39

Assembly Details and Further Technical Remarks Part 1

Watch part 2
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