- System in package
- System on board
- Secure solutions
- Turnkey solutions
On request Infineon offers modifications of all existing Infineon products as ASIC. Our customer defines the business model - please provide your business case with description of functionality with below request form.
Solutions and services
We offer innovative and value added solutions by providing best solution for customers to optimize system BOM and supporting all required product features enabling customer’s market success.
A simple and reliable one-stop shop with reduced project and reduced logistics complexity - our interest is to build long-term business relationships on mutual trust and delivery on commitments.
We support our customers facing tight market windows and they can count on our execution excellence and speed without any compromises in quality. We can complement customer’s business accessing to latest Design Flows, Technology & IP & Packaging.
Design implementation flow
The ASIC design flow is a highly automated approach applying state-of-the-art deep submicron design methodologies such as early floor planning, links-to-layout, timing driven placement and routing.
The first time right claim is backed by design-for-test measures such as full scan design, ATPG (Automatic Test Pattern Generation), BIST (Built-in Self Test), macro isolation with boundary scan, IDDQ testing etc.
Tight time-to-market cycles are met by using advanced verification methods such as static timing analysis, formal verification and well defined sign-off procedures for all techologies.
For the various design steps we use industry leading, commercially available tools. Our emphasis on standard interfaces and tools simplifies integration with the customer design flow tremendously.
We ensure continuous learning on design-flow and technology and implement regular updates of our design system and libraries based on latest silicon results.
Customers can take advantage of Infineon’s core competencies in combination with world class analog mixed signal expertise, power, RF, security and embedded control to achieve the product or solution needed in the shortest time possible.
In addition to the standard packages, Infineon offers an extremely broad variety of application- or customer-specific package solutions portfolio (system-in-package, PQFP BGA, flip-chip, other)
Infineon strives to increase the bandwidth of customers to develop products for the market and enable building and marketing innovative solutions with our technology and system know-how.
We partner with our customers to define the level of cooperation. We are flexible in our design participation, IP delivery, packaging and testing. Whatever model the customer may choose for his business - high professional program management is guaranteed to ensure time-to-market product success.