To ensure a proper processing of lead-free products, technical information is necessary about reliability and solderability.
In this section information about processability of lead-free products is provided:
Besides the change of solders paste(s) for board level assembly, also the new lead-free material of semiconductor terminations will have influence on the metallurgy of the solder joint. In the awareness that not every board will be assembled with a lead-free solder paste with the date of Infineon´s conversion to "green product", the lead-free balls, bumps and lead-finish must be compatible with both SnPb-solder and lead-free solder.
One of the most important properties of a semiconductor termination is its solderability. The surface finish is applied to guarantee solderability even after specified storage time and - in particular - after desiccation processes. The solderability must be possible with all common electronic solders. In order to verify compatibility with both tin-lead and lead-free solders, tests are conducted with both materials.