ToF 3D image sensors for consumer

REAL3™ 3D image sensors based on Infineon's Time-of-Flight (ToF) technology – powering the smallest depth-sensing 3D camera modules in the market

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Overview

Infineon's REAL3™ 3D imager solutions are based on highly integrated Time-of-Flight (ToF) technology and are part of Infineon’s industry-leading XENSIV™ sensor portfolio. Tailored to the consumer and industrial markets, the REAL3™ ToF 3D sensors in bare die form unlock a world of exciting applications while setting the highest performance and security benchmarks in new use cases. 

Key Features

  • Accurate & precise depth sensing
  • High resolution, long range types
  • Sunlight robust
  • Smallest form factor
  • Lower power consumption
  • On-chip integrated laser safety
  • In-factory calibration
  • Dedicated VCSEL driver portfolio

Products

About

REAL3™ ToF imager solutions are the perfect fit for the smallest 3D vision camera modules, combining accurate depth measurement over the short and longer ranges with the lowest power consumption. The REAL3™ product portfolio for consumer applications comprises dedicated 3D single-chip image sensors with different pixel resolutions and is delivered as bare die. The imagers are highly configurable to meet different application requirements, like supporting HDR modes and dual illuminations (for hybrid ToF use-cases). Thanks to its patented Suppression of Background Illumination (SBI) technology, they support camera deployments under all ambient light conditions.

The BOM-optimized REAL3™ ToF hardware is complemented by a broad network of global design, software, and manufacturing partners providing optimal support, high innovation power, and fast time to market to all REAL3™ customers. You can leverage Infineon’s partner network of module makers and camera design houses for complete ToF camera modules to directly use the 3D point cloud in your application. Please contact our support center for more information.

Embrace the next generation of depth sensing with state-of-the-art ToF 3D image sensors, offering unrivaled performance, immersive experiences, and versatility for a broad spectrum of use cases.

The winning combo: High-resolution REAL3™ ToF 3D  imager and efficient VCSEL (Vertical Cavity Surface Emitting Laser) drivers to foster the world's smallest 3D camera modules.
The REAL3™ VCSEL driver ICs have been designed specifically with the Infineon REAL3™ imager portfolio in mind. Together, they enable high-performance 3D camera systems, facilitating ease of integration, a reduced BOM for optimized cost and form factor, and power efficiency gains while providing a fully integrated eye safety solution. Highlights include support for single-, dual-, and triple-junction VCSELs, fast switching behavior up to 250 MHz, and ultra-small packages.

The powerful data provided by a Time-of-Flight camera can be used in a variety of applications and use cases:

Personal electronics
Use 3D data for secure face authentication, augmented reality, high-resolution scanning, or optimizing photography and videos (autofocus, bokeh effects).

  • Smartphones and tablets
  • AR headsets and glasses
  • Other wearables

Consumer & Service robots
Use 3D data for navigation, self-localization and mapping (SLAM), advanced obstacle avoidance, and cliff detection.

  • Robot vacuum cleaners (RVC)
  • Lawn mower
  • Delivery and service robots, automated guided vehicles (AGV)
  • Social and entertainment robots, edutainment, and robot toys
  • Humanoid robots, collaborative robotics

Payment systems
Use 3D data for sunlight-robust and secure face authentication and identification.

  • Point of sale (POS)

Home security and monitoring systems
Use 3D data for secure face authentication and identification, as well as room monitoring.

  • Smart door locks and access control
  • Area surveillance
  • People counting

In this section, you will find informative and engaging webinars about ToF sensors in consumer electronics.

From the fundamental of ToF sensors to their practical implementation in real-world depth cameras, our online resources cover a wide range of topics to help you stay up to date with the latest advancements in this rapidly evolving field. 

Check out our curated online content and stay ahead in the world of ToF consumer sensors:

Using REAL3™ Time-of-Flight 3D imagers from Infineon enables machines to understand the world around them and helps them make smart decisions. Have a look at the latest market news and press releases about REAL3™ Time-of-Flight.

REAL3™ ToF imager solutions are the perfect fit for the smallest 3D vision camera modules, combining accurate depth measurement over the short and longer ranges with the lowest power consumption. The REAL3™ product portfolio for consumer applications comprises dedicated 3D single-chip image sensors with different pixel resolutions and is delivered as bare die. The imagers are highly configurable to meet different application requirements, like supporting HDR modes and dual illuminations (for hybrid ToF use-cases). Thanks to its patented Suppression of Background Illumination (SBI) technology, they support camera deployments under all ambient light conditions.

The BOM-optimized REAL3™ ToF hardware is complemented by a broad network of global design, software, and manufacturing partners providing optimal support, high innovation power, and fast time to market to all REAL3™ customers. You can leverage Infineon’s partner network of module makers and camera design houses for complete ToF camera modules to directly use the 3D point cloud in your application. Please contact our support center for more information.

Embrace the next generation of depth sensing with state-of-the-art ToF 3D image sensors, offering unrivaled performance, immersive experiences, and versatility for a broad spectrum of use cases.

The winning combo: High-resolution REAL3™ ToF 3D  imager and efficient VCSEL (Vertical Cavity Surface Emitting Laser) drivers to foster the world's smallest 3D camera modules.
The REAL3™ VCSEL driver ICs have been designed specifically with the Infineon REAL3™ imager portfolio in mind. Together, they enable high-performance 3D camera systems, facilitating ease of integration, a reduced BOM for optimized cost and form factor, and power efficiency gains while providing a fully integrated eye safety solution. Highlights include support for single-, dual-, and triple-junction VCSELs, fast switching behavior up to 250 MHz, and ultra-small packages.

The powerful data provided by a Time-of-Flight camera can be used in a variety of applications and use cases:

Personal electronics
Use 3D data for secure face authentication, augmented reality, high-resolution scanning, or optimizing photography and videos (autofocus, bokeh effects).

  • Smartphones and tablets
  • AR headsets and glasses
  • Other wearables

Consumer & Service robots
Use 3D data for navigation, self-localization and mapping (SLAM), advanced obstacle avoidance, and cliff detection.

  • Robot vacuum cleaners (RVC)
  • Lawn mower
  • Delivery and service robots, automated guided vehicles (AGV)
  • Social and entertainment robots, edutainment, and robot toys
  • Humanoid robots, collaborative robotics

Payment systems
Use 3D data for sunlight-robust and secure face authentication and identification.

  • Point of sale (POS)

Home security and monitoring systems
Use 3D data for secure face authentication and identification, as well as room monitoring.

  • Smart door locks and access control
  • Area surveillance
  • People counting

In this section, you will find informative and engaging webinars about ToF sensors in consumer electronics.

From the fundamental of ToF sensors to their practical implementation in real-world depth cameras, our online resources cover a wide range of topics to help you stay up to date with the latest advancements in this rapidly evolving field. 

Check out our curated online content and stay ahead in the world of ToF consumer sensors:

Using REAL3™ Time-of-Flight 3D imagers from Infineon enables machines to understand the world around them and helps them make smart decisions. Have a look at the latest market news and press releases about REAL3™ Time-of-Flight.

Documents

Design resources

Developer community

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