3D Image Sensor REAL3™

Overview

REAL3™ 3D image sensor with ToF technology opens up exciting new use cases in consumer and industrial applications

Infineon’s REAL3™ image sensor family opens up a completely new world of exciting applications for devices deployed in consumer and industrial markets, while also setting new performance and security benchmarks for existing use cases.

The REAL3™ image sensors are based on Infineon ToF (Time of Flight), which is the most advanced vision sensing technology in the world today and is already powering the smallest depth-sensing 3D camera modules on the market.

Infineon’s REAL3™ 3D image sensor delivers depth data in real time with a capture speed in the order of milliseconds; it is contact-less, fast and robust to ambient lightning conditions. Thanks to its patented technology for suppression of background illumination (SBI), REAL3™ supports camera deployments under all ambient light conditions. REAL3™ time-of-flight image sensors allow electronic devices to build a 3-dimensional map of the scene in front of the electronic gadget – whether that be a room, a moving or static object or a person – and translate that map to the digital world in real time. Advanced algorithms use that data to measure distance and size and to track motion and movements.

In addition, the single-chip REAL3™ imager brings a third dimension to biometric identification, to 3D scanning and to hand gesture and body tracking. Outstanding performance in 3D computational photography and augmented reality applications revolutionize the user experience.  

 

Highlights
0:30

3D vision to sense the world:

New Infineon 3D image sensor specially designed to fulfill the requirements of the consumer and mobile communication markets.

Press releases

Details

Get more Information about REAL3™

Time-of-Flight Principle & Benefits
Time-of-flight technology is directly measuring the depth and amplitude information in every pixel by using only one infrared flash light source. The modulated infrared light is emitted to the whole scenery and the reflected light is captured by the ToF imager. The measured phase difference between emitted and received light as well as the amplitude values are resulting into highly reliable distance information and a grey scale picture of the complete scene simultaneously.
This principle keeps the power consumption at a minimum and provides fast data acquisition for real-time operation. Also, the required depth data processing for ToF is known to be less demanding than for other algorithm intensive depth sensing technologies like structured light or stereovision, saving additionally power at the application processor.

 

An inherent benefit of the time-of-flight technology is the simple and robust design of a ToF camera module. It consists of only two key components, the imager and one single flash illumination component, without the need of any mechanical baseline. This results in very small camera modules with high integration flexibility into demanding applications like a mobile phone and a lean and fast calibration procedure for easy and robust mass production.
REAL3™ ToF benefits at a glance:

Benefit REAL3™ Image Sensor based on Time-of-Flight
Robust and accurate depth data
  • Direct measurement of depth and amplitude in every pixel; no intensive calculations needed
  • Optimized CMOS technology for highest infrared photo sensitivity
Full operation in bright sunlight and darkness
  • Active modulated IR-light
  • Extended dynamic range by patented Suppression of Background Illumination (SBI) functionality in every pixel
System design flexibility; small form factor
  • Single-chip ToF imager with integrated standard camera interface
  • Single lens design: no mechanical baseline needed
Low depth map calculation efforts; low CPU usage
  • Sensor directly provides raw depth data; no intensive calculations needed
Ease of calibration
  • Easy once-in-a-lifetime calibration
  • Monocular system architecture: i.e. no meachnical alignment and angle correction
Robustness over lifetime
  • Monocular system architecture: no risk of de-calibration due to drops, vibrations or thermal bending
Usability in a mobile device
  • Indoor- and outdoor usability through sunlight robustness
  • High design flexibility because of monocular design (no mechanical baseline)
  • Dynamically configurable: run-time adaption for optimal performance and power consumption

REAL3™ Image Sensor Family

The REAL3™ image sensor family consists of highly integrated 3D Time-of-Flight imager. The ToF sensors have been jointly developed by Infineon and pmdtechnologies AG. They embed a high performance ToF pixel-matrix from pmd and are manufactured in Infineon’s volume-proven ToF optimized CMOS process. The high level of integration, the unique performance and the manifold features enable most accurate and reliable depth data and smallest camera module designs.

 

Product key features

Highest level of integration
  • Integrated A/D converters for full digital readout
  • Integrated high-speed serial interface (CSI-2) and parallel interface (IRS1125 only)
  • Integrated controller and logic for:

    -Illumination control
    -Pixel matrix modulation
    -Autonomous imaging phase sequences
 Best performance
  • Optimized CMOS technology for highest photo sensitivity
  • Patented Suppression of Background Illumination (SBI)
  • Fast global shutter data readout for real-time applications
  • Frame rates up to 100fps
  • Modulation frequency up to 100MHz
 Highest functionality
  • Flexible imager and module configuration after each frame

    - Exposure time
    - Modulation frequence
    - Frame rate
  • Configurable region of interest

 Product variants

 Type  Pixel Resolution  Description  Application  Package  Status
IRS1125C 352 x 288 pixel (100k pixel) ToF single-chip with ~100k pixel targeting high resolution and wide FOV applications Consumer Electronics bare die in production
IRS1645C 224 x 172 pixel (38k pixel) ToF single-chip with ~38k pixel resolution, 850nm Consumer Electronics bare die in production
IRS2381C 224 x 172 pixel (38k pixel) ToF single-chip optimized for mobile applications with ~38k pixel resolution, 940nm Consumer Electronics bare die in production
IRS2771C

448 x 336 pixel output

(150 k pixel HVGA)

 ToF single-chip optimized for mobile applications with ~150k pixel resolution, 940nm Consumer Electronics bare die in development
IRS1125A

352 x 288 pixel (100k pixel)

 ToF single-chip with 100k pixel, automotive qualified, T_amb: -40°C to 105°C Automotive PG-LFBGA-84 in development

 

Tools & Software

3D reference cameras

To evaluate REAL3™ Time-of-Flight technology, various 3D reference cameras are available. The CamBoard pico family is designed by our development partner pmdtechnologies. These reference cameras come with a powerful SDK providing a high-quality depth map for evaluation and application software development. For consumer mobile applications, the CamBoard picoflexx camera is the product of choice as it can be easily integrated into a mobile device. The CamBoard pico flexx features flexible working ranges, flexible frame rates, Android support, MacOS support and reduced depth noise. For further details and to order one of these reference cameras, please visit http://pmdtec.com/picofamily/

Videos
0:30

3D vision to sense the world

New Infineon 3D image sensor specially designed to fulfill the requirements of the consumer and mobile communication markets.

2:55

Why does Time-of-Flight (TOF) camera matter for your application?

With voice-controlled applications, the consumer electronic industry is moving towards more natural user interfaces. The way we interact with technology is evolving and the 3D image sensor (TOF) is the next step, making tech more intuitive. The Infineon 3D image sensor Real 3™ is specially designed to fulfill the requirements of the consumer and mobile communication markets. REAL3™ has - best 3D camera capabilities, even in bright sunlight and darkness - secure face recognition - system design flexibility: the smallest form factor - efficient power consumption - robustness over lifetime At beginning of 2019 @MWC Barcelona LG introduced their first phone with 3D front facing camera by Infineon.

New Infineon 3D Time-of-Flight imager for smallest depth sensing cameras in mobile devices

We introduce the latest REAL3TM  imager IRS2381C.
Be inspired by the incredible miniaturization while keeping highest performance to meet outdoor requirements of mobile devices.

Infineon and pmd demonstrate of the world’s smallest 3D camera module with ToF

Infineon Technologies and pmdtechnologies display their next generation 3D depth sensing ToF solution for front and world-facing smartphone applications; also suited to multiple application designs like smart home cameras and AR/VR headsets. 3D is everywhere.

Infineon Technologies Demonstration of a 3D ToF In-cabin Sensing Solution for Automotive

Based on the REAL3 Time-of-Flight imager with 352x288 pixel resolution and a wide FOV reference camera use-cases for an in-cabin sensing solution are demonstrated. Both, driver and passenger can be detected under all light conditions with one camera.

Partners

Infineon co-developed the 3D image sensor family REAL3 with pmdtechnologies AG from Siegen, Germany. Both companies are jointly providing the technical support for camera module makers. The contribution of pmdtechnologies to the REAL3 chip family is the ToF pixel matrix. Infineon contributes all functional blocks for the system-on-chip (SoC) integration and developed the ToF optimized CMOS manufacturing process.

Applications

REAL3™ for Consumer Applications
The monocular camera architecture and the compact REAL3 single-chip design enable smallest form factor camera modules and a robust integration into mobile devices. There is no need for a mechanical baseline or any risk of de-calibration in the field. The high performance of the REAL3 imager with its unique Suppression of Background Illumination (SBI) circuitry ensures robust operation in strong sunlight with a minimum of power – all mandatory requirements of battery driven applications.

REAL3 is the first 3D depth sensing technology integrated into commercially available Tango enabled smartphones, Google’s technology to give mobile devices a human-scale understanding of space and motion.

 

Focus applications and use-cases

  • Mobile phones and tablets

         - Front facing cameras: secure face recognition

         - World facing cameras: environmental monitoring, augmented reality, 3D scanning and reconstruction

  • Head mounted devices, virtual reality, hand- and gesture tracking
  • Smart home cameras, surveillance
  • Drones, collision avoidance

REAL3™ for Automotive Applications
On the way to highly automated driving it is important to know what is happening inside the car, in special when the car interior of the future becomes much more flexible than today. The solution is a Time-of-Flight camera providing the most robust and reliable 3D data of the cabin and its passengers, even under strong sunlight conditions.


A dedicated automotive REAL3 imager variant is in development. It comprises all volume-proven product benefits of the consumer variants by fulfilling automotive requirements: packaged imager, wide temperature range of -40°C to 105°C and AEC-Q100 qualification.

 

Focus applications and use-cases

  • In-cabin sensing: new HMI and passive safety concepts

         - Body pose tracking & gesture control

         - Presence & object detection

         - Passenger classification

         - Driver state monitoring

         - Personalized and situational adapted safety systems

  • Exterior sensing, short range (<10 meter)

 

REAL3™ for Industrial Applications
3D depth data is beneficial for numerous applications from factory automation and robotics to people counting and any kind of specialized depth sensing product idea. Due to the high diversity of such applications and their requirements they are supported through established ToF camera module makers and camera design-house partners only.


Please contact us and clearly describe your application requirements - we are happy to introduce you to the right partner.

 

Focus applications and use-cases

  • Factory automation
  • Service and entertainment robots
  • Cleaning robots and lawn mover
  • Automated Guided Vehicles (AVG)
  • Automated warehouse and logistic systems
  • Area surveillance and people counting

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