MEMS microphones with Infineon XENSIV™ MEMS and ASIC
Our packaging partners use XENSIV™ MEMS and ASICs to provide you with a full range of MEMS microphones suitable for a variety of applications.
MEMS microphones are increasingly prevalent in the market worldwide. Being the first choice in smartphones for years already, recent advances in MEMS technology paved the way for new features in audio like voice-user interfaces in smart speakers and active noise cancellation (ANC) in True Wireless Stereos (TWS) and headsets, among others. Based on years of semiconductor experience, Infineon is offering a full range of MEMS microphones as bare dies (MEMS and ASIC).
To find your tailor-fitted solution for your next target application, Infineon’s global network of packaging partners provide an extensive portfolio of Infineon-based MEMS microphones. Simply browse through our partners’ offerings below and refer to the links used in the texts, such as company logo and purchase link, to navigate directly to the respective website for next steps.