XENSIV™ - low self-noise (SNR), wide dynamic range, low distortions, high acoustic overload point
The popularity of voice user interfaces and the usage of audio recording to share information and experiences are increasing dramatically. However, the performance of microphones often limits the potential of today’s cutting-edge devices. Not anymore!
Infineon XENSIV™ MEMS microphones introduce a new performance class for digital MEMS microphones that overcomes existing audio chain limitations. IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low distortions and a high acoustic overload point are required.
Building upon the superior XENSIVTM MEMS microphone performance, Infineon’s extensive network of global partners offer customers a comprehensive portfolio of XENSIVTM MEMS microphone-based reference designs, as well as Infineon inside MEMS microphones that will propel audio performance to the next level even for the most demanding applications. Click on the buttons below to learn more and purchase our partner solutions.
Features & Benefits
Infineon´s Dual Backplate (DBP) MEMS technology
Infineon's dual backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar as utilized in studio condenser microphones, and results in high linearity of the output signal within a dynamic range of 105 dB.
The microphone noise floor is at 25 dB[A] (69 dB[A] SNR) and distortion does not exceed 1 percent even at sound pressure levels of 128 dB SPL (AOP 130 dB SPL). The flat frequency response (28 Hz low-frequency roll-off) and tight manufacturing tolerance result in close phase matching of the microphones, which is important for multi-microphone (array) applications.
Creating powerful partnerships - Infineon partner ecosystem success stories
Infineon inside MEMS microphone partners
Our Infineon inside MEMS microphone partners provide you with a full range of MEMS microphones suitable for a variety of applications.
XENSIV™ MEMS microphone partner solutions
Premium MEMS microphones and cutting-edge audio processing are the key elements for making voice-controlled devices truly ready for everyday situations. Features like turning off a TV across different rooms as well as the ability to whisper to Alexa to dim down the light will be key differentiators of next-generation voice-user interfaces. That is why Infineon and its voice-user interface ecosystem partners are leveraging their technological expertise to provide innovative reference platforms and ready-to-use next-generation voice-user interface solutions.
Customers looking for a reference design containing Infineon’s XENSIV™ MEMS microphones can contact one of our partners listed below. This section provides an overview and introduction to our partners and their offerings, as well as a relevant distributor or contact person for purchasing support. Kindly refer to the links used in the texts, company logo, and partner signet to navigate directly to the respective website for further information.
- High quality audio capturing: e.g. cameras, camcorders, conference systems
- Voice user interface: e.g. smart speaker, home automation and IoT devices
- Active noise cancellation: headphones and earphones
- Audio pattern detection: predictive maintenance, security or safety applications