S-SPA1.X

Overview

S-SPA1.1-0-1

Designed for integration into payment accessories used in a non-metal environment such as wristbands, key fobs and laminated plastic inlays

S-SPA1.2-0-1

Designed and optimized for sticker applications, with one side shielded with a ferrite material for use on mobile phones or metal cans

Summary of Features

S-SPA1.x-0-1

  • Module technology: Flip chip
  • Punching size [mm]: 27.2 x 17.5
  • Package thickness [mm]: 0.250
  • Pitch [mm]: 19.00
  • Manufacturing requirements: Standard 35 mm tape on reel, guidance for product integration into different form factors (see application note)
  • Package qualification: Results available in qualification report
  • Qualified chip types: 16-bit security controller V01 or as turnkey solution incl. OS and applets (SECORA™ Pay W)

Potential Applications

  • contactless payment
  • transport
  • access control
  • loyalty schemes
Support