S-MFC5.4-6-1 Module is the optimized package solution to support 4FF application as smaller module dimensions (10,42 mm x 7.58 mm) ensure enough distance from module to card edge, reduced module thickness (max. 420µm) ensure easy implementation in thinner card bodies and easy card integration by use of same process parameters and materials as for standard FCOS™ implanting (only new punching tool required) is possible.
With a Package thickness of max. 420µm also laser engraving at the full area of card back side is possible.
Summary of Features:
- 10.4 x 7.6mm
- max. 420µm
- ISO 7816-1, ISO 7810, ISO 10373-1/-3
- Au surface, S-MFC5.4-6-1
- Tape on Reel
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