SECORA™ Pay security solutions
SECORA™ Pay security solutions is a flexible, innovative one-stop solution for current and future payment needs.
SECORA™ Pay is a flexible, innovative one-stop solution for current and future payment needs. Infineon’s SECORA™ Pay solutions, with its excellent technology backed by extensive services and design-in support, enables contactless payment functionality to be integrated into virtually anything.
Infineon’s SECORA™ Pay is based on our unique SOLID FLASH™ microcontroller family, providing outstanding contactless transaction speeds and superior performance for today’s single- and multi-application projects. This family offers a complete portfolio supporting everything from contact cards to smart payment accessories.
Our innovative Coil on Module (CoM) chip package increases production efficiency and general robustness of dual-interface cards, increasing contactless credit card payment security while reducing costs. At the same time, the very small antenna design supports novel contactless payment factors such as smart watches with payment functionality.
- Increased contactless payment safety with fast, flexible payments
- Open standards including the interoperability standard EMVCo and the non-proprietary, open ticketing standard CIPURSE™ and Calypso.
- Dual-interface functionality, contact-based, and contactless transactions
- Supporting all common data authentication schemes
- Innovative contactless card security technologies like CoM and SOLID FLASH™
- Greater power efficiency
SECORA™ Pay Security Product Portfolio
The Infineon SECORA™ Pay portfolio delivers increased contactless payment safety through a range of solutions, including sophisticated Java Card™ technologies, pre-certified payment options, support for smart accessories and wearables, and Visa, Mastercard, Discover, and American Express payment support.
However, increased convenience and environmentally friendly solutions underpinned by the latest 40mn technology providing exceptionally thin modules for dual interface payment cards, easily personalized performance, and the use of recycled and ocean-bound plastics throughout our packaging options help push your contactless offerings to the next level.
The SECORA™ Pay portfolio comprises the Pay S, Pay X and Pay W variants.
For Visa (VSDC), MasterCard (M/Chip), Discover (D-PAS) and American Express credit and debit card contactless security, SECORA™ Pay S offers an optimized, ready-to-use solutions based on the Java Card 3.0.5, GlobalPlatform 2.3.1. Based on contact and dual-interface package options based on Coil on Module packaging and Standard CoM antenna sheets, SECORA™ Pay S also delivers increased contactless payment card security through SDA/DDA/CDA (RSA, 3DES, SHA1, AES) cryptography.
| Operating System | Java Card 3.0.4, GlobalPlatform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 Type A, T=0 |
| Memory for user applets and user data | 16 KB |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Contact and dual-interface package options* | Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork- based scheme approval
Flip chip packages for robust contact card production
*Pure contactless and other packaging options on request |
| Complementary 2/3rd wire antenna design optimized for 4th line embossing |
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| Available and certified Infineon reference EMV applets |
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Designed for multi-application payment cards and local schemes, the SECORA™ Pay X solution enables flexible EMV-based payment schemes and content to be used, for example, to prepare for CPA. Offering ready-to-use options for Visa, MasterCard, Discover, American Express and CIPURSE™, it is based on the Java Card 3.0.5, GlobalPlatform 2.3.1 and integrates Coil on Module packaging, Standard CoM antenna sheets, and Holofoil and colored CoM antenna sheets for comprehensive contactless payment safety.
| Operating System | Java Card 3.0.4, GlobalPlatform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 Type A, T=0 |
| Memory for user applets and user data | Up to 190 KB SOLID FLASH™ NVM as platform-only configuration without any reference applets (Pay X) |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Contact and dual-interface package options* | Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork- based scheme approval
Flip chip packages for robust contact card production
*Pure contactless and other packaging options on request |
| Complementary 2/3rd wire antenna design optimized for 4th line embossing |
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| Available and certified Infineon reference EMV applets |
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| Other optional applications |
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The rise of smart accessories that integrate seamless payment solutions requires sophisticated chip technologies designed to support standard Visa (VSDC) and MasterCard (M/Chip) functionality. SECORA™ Pay W is ready for multi-application and local schemes on the Java Card 3.0.5, GlobalPlatform 2.3.1. Integrating SPA antenna design, MCC8 antenna design tailored to customer needs, and optional integration of the CIPURSE™ T applet, Infineon’s SECORA™ Pay W is a comprehensive solution to contactless credit card security issues within smart accessories.
| Operating System | Java Card 3.0.4, GlobalPlatform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 Type A, T=0 |
| Memory for user applets and user data | 16 KB |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Dual-interface package options |
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| Wire antenna design | • SPA: antenna design included in delivery package • MCC8: antenna design will be tailored to customer needs |
| Available and certified Infineon reference EMV applets |
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| Other optional applications |
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