- ASIC
- Battery management ICs
- Clocks and timing solutions
- ESD and surge protection devices
- Automotive Ethernet
- Evaluation Boards
- High reliability
- Isolation
- Memories
- Microcontroller
- Power
- RF
- Security and smart card solutions
- Sensor technology
- Small signal transistors and diodes
- Transceivers
- Universal Serial Bus (USB)
- Wireless connectivity
- Search Tools
- Technology
- Packages
- Product Information
- Where to Buy
- Overview
- Automotive Ethernet Bridges
- Automotive Ethernet PHY for in-vehicle networking
- Automotive Ethernet Switches for in-vehicle networking
- Overview
- Defense
- High-reliability custom services
- NewSpace
- Space
- Overview
- Embedded flash IP solutions
- Flash+RAM MCP solutions
- F-RAM (Ferroelectric RAM)
- NOR flash
- nvSRAM (non-volatile SRAM)
- PSRAM (Pseudostatic RAM)
- Radiation hardened and high-reliability memories
- RRAM Resistive Ram
- SRAM (static RAM)
- Wafer and die memory solutions
- Overview
- 32-bit FM Arm® Cortex® Microcontroller
- 32-bit AURIX™ TriCore™ microcontroller
- 32-bit PSOC™ Arm® Cortex® microcontroller
- 32-bit TRAVEO™ T2G Arm® Cortex® microcontroller
- 32-bit XMC™ industrial microcontroller Arm® Cortex®-M
- Legacy microcontroller
- MOTIX™ MCU | 32-bit motor control SoC based on Arm® Cortex®-M
- Sensing controllers
- Overview
- AC-DC power conversion
- Automotive conventional powertrain ICs
- Class D audio amplifier ICs
- Contactless power and sensing ICs
- DC-DC converters
- Diodes and thyristors (Si/SiC)
- Gallium nitride (GaN)
- Gate driver ICs
- IGBTs – Insulated gate bipolar transistors
- Intelligent power modules (IPM)
- LED driver ICs
- Motor control ICs
- Power MOSFETs
- Power modules
- Power supply ICs
- Protection and monitoring ICs
- Silicon carbide (SiC)
- Smart power switches
- Solid state relays
- Wireless charging ICs
- Overview
- Antenna cross switches
- Antenna tuners
- Bias and control
- Coupler
- Driver amplifiers
- High Reliability Discrete
- Low noise amplifiers (LNAs)
- RF diode
- RF switches
- RF transistors
- Wireless control receiver
- Overview
- Calypso® products
- CIPURSE™ products
- Contactless memories
- OPTIGA™ embedded security solutions
- SECORA™ security solutions
- Security controllers
- Smart card modules
- Smart solutions for government ID
- Overview
- ToF 3D image sensors
- Current sensors
- Gas sensors
- Inductive position sensors
- MEMS microphones
- Pressure sensors
- Radar sensors
- Magnetic position sensors
- Magnetic speed sensors
- Overview
- Bipolar transistors
- Diodes
- Small signal/small power MOSFET
- Overview
- Automotive transceivers
- Control communication
- Powerline communications
- Overview
- USB 2.0 peripheral controllers
- USB 3.2 peripheral controllers
- USB hub controllers
- USB PD high-voltage microcontrollers
- USB-C AC-DC and DC-DC charging solutions
- USB-C charging port controllers
- USB-C Power Delivery controllers
- Overview
- AIROC™ Automotive wireless
- AIROC™ Bluetooth® and multiprotocol
- AIROC™ connected MCU
- AIROC™ Wi-Fi + Bluetooth® combos
- Overview
- Commercial off-the-shelf (COTs) memory portfolio
- Defense memory portfolio
- High-reliability power conversion and management
- Overview
- Rad hard microwave and RF
- Radiation hardened power
- Space memory portfolio
- Overview
- Parallel NOR flash
- SEMPER™ NOR flash family
- SEMPER™ X1 LPDDR flash
- Serial NOR flash
- Overview
- FM0+ 32-bit Arm® Cortex®-M0+ microcontroller (MCU) families
-
FM3 32-bit Arm® Cortex®-M3 microcontroller (MCU) families
- Overview
- FM3 CY9AFx1xK series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx1xL/M/N series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx2xK/L series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx3xK/L series ultra-low leak Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx4xL/M/N series low power Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx5xM/N/R series low power Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFxAxL/M/N series ultra-low leak Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx1xN/R high-performance series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx1xS/T high-performance series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx2xJ series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx2xK/L/M series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx2xS/T series Arm® Cortex®-M3 microcontroller (MCU)
-
FM4 32-bit Arm® Cortex®-M4 microcontroller (MCU) families
- Overview
- FM4 CY9BFx6xK/L high-performance series Arm® Cortex®-M4F microcontroller (MCU)
- FM4 CY9BFx6xM/N/R high-performance series Arm® Cortex®-M4F microcontroller (MCU)
- FM4 S6E2C high-performance series Arm® Cortex®-M4F microcontroller (MCU)
- FM4 S6E2G series connectivity Arm® Cortex®-M4F microcontroller (MCU)
- FM4 S6E2H high-performance series Arm® Cortex®-M4F microcontroller (MCU)
- Overview
-
32-bit TriCore™ AURIX™ – TC2x
- Overview
- AURIX™ family – TC21xL
- AURIX™ family – TC21xSC (wireless charging)
- AURIX™ family – TC22xL
- AURIX™ family – TC23xL
- AURIX™ family – TC23xLA (ADAS)
- AURIX™ family – TC23xLX
- AURIX™ family – TC264DA (ADAS)
- AURIX™ family – TC26xD
- AURIX™ family – TC27xT
- AURIX™ family – TC297TA (ADAS)
- AURIX™ family – TC29xT
- AURIX™ family – TC29xTT (ADAS)
- AURIX™ family – TC29xTX
- AURIX™ TC2x emulation devices
-
32-bit TriCore™ AURIX™ – TC3x
- Overview
- AURIX™ family - TC32xLP
- AURIX™ family – TC33xDA
- AURIX™ family - TC33xLP
- AURIX™ family – TC35xTA (ADAS)
- AURIX™ family – TC36xDP
- AURIX™ family – TC37xTP
- AURIX™ family – TC37xTX
- AURIX™ family – TC38xQP
- AURIX™ family – TC39xXA (ADAS)
- AURIX™ family – TC39xXX
- AURIX™ family – TC3Ex
- AURIX™ TC37xTE (emulation devices)
- AURIX™ TC39xXE (emulation devices)
- 32-bit TriCore™ AURIX™ – TC4x
- Overview
- PSOC™ 4 Arm® Cortex®-M0/M0+
- PSOC™ 4 HV Arm® Cortex®-M0+
- PSOC™ 5 LP Arm® Cortex®-M3
- PSOC™ 6 Arm® Cortex®-M4/M0+
- PSOC™ Multitouch Arm® Cortex®-M0
- PSOC™ Control Arm® Cortex®-M33
- PSOC™ Fingerprint Arm® Cortex®-M0+
- PSOC™ Automotive 4: Arm® Cortex®-M0/M0+
- PSOC™ Edge Arm® Cortex® M55/M33
- Overview
- 32-bit TRAVEO™ T2G Arm® Cortex® for body
- 32-bit TRAVEO™ T2G Arm® Cortex® for cluster
- Overview
- 32-bit XMC1000 industrial microcontroller Arm® Cortex®-M0
- 32-bit XMC4000 industrial microcontroller Arm® Cortex®-M4
- XMC5000 Industrial Microcontroller Arm® Cortex®-M4F
- 32-bit XMC7000 Industrial Microcontroller Arm® Cortex®-M7
- Overview
- Legacy 32-bit MCU
- Legacy 8-bit/16-bit microcontroller
- Other legacy MCUs
- Overview
- AC-DC integrated power stage - CoolSET™
- AC-DC PWM-PFC controller
- Overview
- Bridge rectifiers & AC switches
- CoolSiC™ Schottky diodes
- Diode bare dies
- Silicon diodes
- Thyristor / Diode Power Modules
- Thyristor soft starter modules
- Thyristor/diode discs
- Overview
- Automotive gate driver ICs
- Isolated Gate Driver ICs
- Level-Shift Gate Driver ICs
- Low-Side Drivers
- Transformer Driver ICs
- Overview
- AC-DC LED driver ICs
- Ballast IC
- DC-DC LED driver IC
- LED dimming interface IC
- Linear LED driver IC
- LITIX™ - Automotive LED Driver IC
- NFC wireless configuration IC with PWM output
- VCSEL driver
- Overview
- 32-bit PSOC™ Control Arm® Cortex®-M33 MCU
- iMOTION™ Integrated motor control solutions
- MOTIX™ MCU | 32-bit motor control SoC based on Arm® Cortex®-M
- MOTIX™ motor control ICs for BLDC motors
- MOTIX™ motor control ICs for brushed DC motors
- MOTIX™ multi half-bridge ICs for servo and stepper motors
- Overview
- Automotive MOSFET
- Dual MOSFETs
- MOSFET (Si & SiC) Modules
- N-channel depletion mode MOSFET
- N-channel power MOSFETs
- Silicon carbide CoolSiC™ MOSFETs
- Small signal/small power MOSFET
- Overview
- Automotive transceivers
- Linear Voltage Regulators for Automotive Applications
- OPTIREG™ PMIC
- OPTIREG™ switcher
- OPTIREG™ System Basis Chips (SBC)
- Overview
- eFuse
-
High-side switches
- Overview
- Classic PROFET™ 12V | Automotive smart high-side switch
- Classic PROFET™ 24V | Automotive smart high-side switch
- Power PROFET™ + 12/24/48V | Automotive smart high-side switch
- PROFET™ + 12V | Automotive smart high-side switch
- PROFET™ + 24V | Automotive smart high-side switch
- PROFET™ + 48V | Automotive smart high-side switch
- PROFET™ +2 12V | Automotive smart high-side switch
- PROFET™ Industrial | Smart high-side switch
- PROFET™ Load Guard 12V | Automotive smart high-side switch
- PROFET™ Wire Guard 12V | Automotive eFuse
- Low-side switches
- Multichannel SPI Switches & Controller
- Overview
- Radar sensors for automotive
- Radar sensors for IoT
- Overview
- EZ-USB™ CX3 MIPI CSI2 to USB 3.0 camera controller
- EZ-USB™ FX10 & FX5N USB 10Gbps peripheral controller
- EZ-USB™ FX20 USB 20 Gbps peripheral controller
- EZ-USB™ FX3 USB 5 Gbps peripheral controller
- EZ-USB™ FX3S USB 5 Gbps peripheral controller with storage interface
- EZ-USB™ FX5 USB 5 Gbps peripheral controller
- EZ-USB™ SD3 USB 5 Gbps storage controller
- EZ-USB™ SX3 FIFO to USB 5 Gbps peripheral controller
- Overview
- EZ-PD™ CCG3 USB type-C port controller PD
- EZ-PD™ CCG3PA USB-C and PD
- EZ-PD™ CCG3PA-NFET USB-C PD controller
- EZ-PD™ CCG7x consumer USB-C Power Delivery & DC-DC controller
- EZ-PD™ PAG1: power adapter generation 1
- EZ-PD™ PAG2: Power Adapter Generation 2
- EZ-PD™ PAG2-PD USB-C PD Controller
- Overview
- EZ-PD™ ACG1F one-port USB-C controller
- EZ-PD™ CCG2 USB Type-C port controller
- EZ-PD™ CCG3PA Automotive USB-C and Power Delivery controller
- EZ-PD™ CCG4 two-port USB-C and PD
- EZ-PD™ CCG5 dual-port and CCG5C single-port USB-C PD controllers
- EZ-PD™ CCG6 one-port USB-C & PD controller
- EZ-PD™ CCG6_CFP and EZ-PD™ CCG8_CFP Dual-Single-Port USB-C PD
- EZ-PD™ CCG6DF dual-port and CCG6SF single-port USB-C PD controllers
- EZ-PD™ CCG7D Automotive dual-port USB-C PD + DC-DC controller
- EZ-PD™ CCG7S Automotive single-port USB-C PD solution with a DC-DC controller
- EZ-PD™ CCG7SAF Automotive Single-port USB-C PD + DC-DC Controller + FETs
- EZ-PD™ CCG8 dual-single-port USB-C PD
- EZ-PD™ CMG1 USB-C EMCA controller
- EZ-PD™ CMG2 USB-C EMCA controller with EPR
- LATEST IN
- Aerospace and defense
- Automotive
- Consumer electronics
- Health and lifestyle
- Home appliances
- Industrial
- Information and Communication Technology
- Renewables
- Robotics
- Security solutions
- Smart home and building
- Solutions
- Overview
- Defense applications
- Space applications
- Overview
- 48 V systems for EVs & mild hybrids
- ADAS & autonomous driving
- Automotive body electronics & power distribution
- Automotive LED lighting systems
- Chassis control & safety
- Electric vehicle drivetrain system
- EV thermal management system
- Internal combustion drivetrain systems
- In-vehicle infotainment & HMI
- Light electric vehicle solutions
- Overview
- Adapters and chargers
- Complete system solutions for smart TVs
- Mobile device and smartphone solutions
- Multicopters and drones
- Power tools
- Semiconductor solutions for home entertainment applications
- Smart conference systems
- Overview
- Adapters and chargers
- Asset Tracking
- Battery formation and testing
- Electric forklifts
- Battery energy storage (BESS)
- EV charging
- High voltage solid-state power distribution
- Industrial automation
- Industrial motor drives and controls
- Industrial robots system solutions for Industry 4.0
- LED lighting system design
- Light electric vehicle solutions
- Power tools
- Power transmission and distribution
- Traction
- Uninterruptible power supplies (UPS)
- Overview
- Data center and AI data center solutions
- Edge computing
- Telecommunications infrastructure
- Machine Learning Edge AI
- Overview
- Battery formation and testing
- EV charging
- Hydrogen
- Photovoltaic
- Wind power
- Solid-state circuit breaker
- Battery energy storage (BESS)
- Overview
- Device authentication and brand protection
- Embedded security for the Internet of Things (IoT)
- eSIM applications
- Government identification
- Mobile security
- Payment solutions
- Access control and ticketing
- Overview
- Domestic robots
- Heating ventilation and air conditioning (HVAC)
- Home and building automation
- PC accessories
- Semiconductor solutions for home entertainment applications
- Overview
- Battery management systems (BMS)
- Connectivity
- Human Machine Interface
- Machine Learning Edge AI
- Motor control
- Power conversion
- Security
- Sensor solutions
- System diagnostics and analytics
- Overview
- Automotive auxiliary systems
- Automotive gateway
- Automotive power distribution
- Body control modules (BCM)
- Comfort & convenience electronics
- Zonal DC-DC converter 48 V-12 V
- Zone control unit
- Overview
- Automotive animated LED lighting system
- Automotive LED front single light functions
- Automotive LED rear single light functions
- Full LED headlight system - multi-channel LED driver
- LED drivers (electric two- & three-wheelers)
- LED pixel light controller - supply & communication
- Static interior ambient LED light
- Overview
- Active suspension control
- Airbag system
- Automotive braking solutions
- Automotive steering solutions
- Chassis domain control
- Reversible seatbelt pretensioner
- Overview
-
Automotive BMS
- Overview
- Automotive battery cell monitoring & balancing
- Automotive battery control unit (BCU)
- Automotive battery isolated communication
- Automotive battery management system (BMS) - 12 V to 24 V
- Automotive battery management system (BMS) - 48 V
- Automotive battery management system (BMS) - high-voltage
- Automotive battery pack monitoring
- Automotive battery passport & event logging
- Automotive battery protection & disconnection
- Automotive current sensing & coulomb counting
- BMS (electric two- & three-wheelers)
- EV charging
- EV inverters
- EV power conversion & OBC
- FCEV powertrain system
- Overview
- Automatic transmission hydraulic system
- Belt starter generator 48 V – inverter ISG
- Diesel direct injection
- Double-clutch transmission electrical control
- Double-clutch transmission hydraulic control
- Gasoline direct injection
- Multi-port fuel injection
- Small 1-cylinder combustion engine solution
- Small engine starter kit
- Transfer case brushed DC
- Transfer case brushless DC (BLDC)
- Overview
- Automotive head unit
- Automotive USB-C power & data solution
- Automotive instrument cluster
- Automotive telematics control unit (TCU)
- Center information display (CID)
- High-performance cockpit controller
- In-cabin wireless charging
- Smart instrument cluster (electric two- & three-wheelers)
- Overview
- E-bike solutions
- Two- & three-wheeler solutions
- Overview
- Audio amplifier solutions
- Complete system solutions for smart TVs
- Distribution audio amplifier unit solutions
- Home theater installation speaker system solutions
- Party speaker solutions
- PoE audio amplifier unit solutions
- Portable speaker solutions
- Powered active speaker systems
- Remote control
- Smart speaker designs
- Soundbar solutions
- Overview
- Data center and AI data center solutions
- Digital input/output (I/O) modules
- DIN rail power supply solutions
- Home and building automation
- Industrial HMI Monitors and Panels
- Industrial motor drives and controls
- Industrial PC
- Industrial robots system solutions for Industry 4.0
- Industrial sensors
- Machine vision
- Mobile robots (AGV, AMR)
- Programmable logic controller (PLC)
- Solid-state circuit breaker
- Uninterruptible power supplies (UPS)
- Overview
- 48 V intermediate bus converter (IBC)
- AI accelerator cards
- AMD server CPUs
- Ampere CPUs
- FPGAs in datacenter applications
- Intel server CPUs
- Networking and switch platforms
- Power path protection
- Power system reliability modeling
- RAID storage
- Server battery backup units (BBU)
- Server power supply
- SmartNIC cards
- Overview
- AC-DC power conversion for telecommunications infrastructure
- DC-DC power conversion for telecommunications infrastructure
- FPGA in wired and wireless telecommunications applications
- Satellite communications
- Power system reliability modeling
- RF front end components for telecommunications infrastructure
- Overview
-
AC-DC power conversion
- Overview
- AC-DC auxiliary power supplies
- AC-DC power conversion for telecommunications infrastructure
- Adapters and chargers
- Automotive LED lighting systems
- Complete system solutions for smart TVs
- Desktop power supplies
- EV charging
- Industrial power supplies
- PoE power sourcing equipment (PSE)
- Server power supply units (PSU)
- Uninterruptible power supplies (UPS)
- DC-DC power conversion
- Overview
- Power supply health monitoring
- LATEST IN
- Digital documentation
- Evaluation boards
- Finder & selection tools
- Platforms
- Services
- Simulation & Modeling
- Software
- Tools
- Partners
- Infineon for Makers
- University Alliance Program
- Overview
- Bipolar Discs Finder
- Bipolar Module Finder
- Connected Secure Systems Finder
- Diode Rectifier Finder
- ESD Protection Finder
- Evaluation Board Finder
- Gate Driver Finder
- IGBT Discrete Finder
- IGBT Module Finder
- IPM Finder
- Microcontroller Finder
- MOSFET Finder
- PMIC Finder
- Product Finder
- PSOC™ and FMx MCU Board & Kit Finder
- Radar Finder
- Reference Design Finder
- Simulation Model Finder
- Smart Power Switch Finder
- Transceiver Finder
- Voltage Regulator Finder
- Wireless Connectivity Board & Kit Finder
- Overview
- AIROC™ software & tools
- AURIX™ software & tools
- Drive Core for automotive software development
- iMOTION™ software & tools
- Infineon Smart Power Switches & Gate Driver Tool Suite
- MOTIX™ software & tools
- OPTIGA™ software & tools
- PSOC™ software & tools
- TRAVEO™ software & tools
- XENSIV™ software & tools
- XMC™ software & tools
- Overview
- CoolGaN™ Simulation Tool (PLECS)
- HiRel Fit Rate Tool
- Infineon Designer
- Interactive product sheet
- IPOSIM Online Power Simulation Platform
- InfineonSpice Offline Simulation Tool
- OPTIREG™ automotive power supply ICs Simulation Tool (PLECS)
- Power MOSFET Simulation Models
- PowerEsim Switch Mode Power Supply Design Tool
- Solution Finder
- XENSIV™ Magnetic Sensor Simulation Tool
- Overview
- AURIX™ certifications
- AURIX™ development tools
-
AURIX™ Embedded Software
- Overview
- AURIX™ Applications software
- AURIX™ Artificial Intelligence
- AURIX™ Gateway
- AURIX™ iLLD Drivers
- Infineon safety
- AURIX™ Security
- AURIX™ TC3xx Motor Control Application Kit
- AURIX™ TC4x SW application architecture
- Infineon AUTOSAR
- Communication and Connectivity
- Middleware
- Non AUTOSAR OS/RTOS
- OTA
- AURIX™ Microcontroller Kits
- Overview
- TRAVEO™ Development Tools
- TRAVEO™ Embedded Software
- Overview
- XENSIV™ Development Tools
- XENSIV™ Embedded Software
- XENSIV™ evaluation boards
- Overview
- CAPSENSE™ Controllers Code Examples
- Memories for Embedded Systems Code Examples
- PSOC™ 1 Code Examples for PSOC™ Designer
- PSOC™ 3 Code Examples for PSOC™ Creator
- PSOC™ 3/4/5 Code Examples
- PSOC™ 4 Code Examples for PSOC™ Creator
- PSOC™ 6 Code Examples for PSOC™ Creator
- PSOC™ 63 Code Examples
- USB Controllers Code Examples
- Overview
- DEEPCRAFT™ AI Hub
- DEEPCRAFT™ Audio Enhancement
- DEEPCRAFT™ Model Converter
-
DEEPCRAFT™ Ready Models
- Overview
- DEEPCRAFT™ Ready Model for Baby Cry Detection
- DEEPCRAFT™ Ready Model for Cough Detection
- DEEPCRAFT™ Ready Model for Direction of Arrival (Sound)
- DEEPCRAFT™ Ready Model for Factory Alarm Detection
- DEEPCRAFT™ Ready Model for Fall Detection
- DEEPCRAFT™ Ready Model for Gesture Classification
- DEEPCRAFT™ Ready Model for Siren Detection
- DEEPCRAFT™ Ready Model for Snore Detection
- DEEPCRAFT™ Studio
- DEEPCRAFT™ Voice Assistant
- Overview
- AIROC™ Wi-Fi & Bluetooth EZ-Serial Module Firmware Platform
- AIROC™ Wi-Fi & Bluetooth Linux and Android Drivers
- emWin Graphics Library and GUI for PSOC™
- Infineon Complex Device Driver for Battery Management Systems
- Memory Solutions Hub
- PSOC™ 6 Peripheral Driver Library (PDL) for PSOC™ Creator
- USB Controllers EZ-USB™ GX3 Software and Drivers
- Overview
- CAPSENSE™ Controllers Configuration Tools EZ-Click
- DC-DC Integrated POL Voltage Regulators Configuration Tool – PowIRCenter
- EZ-USB™ SX3 Configuration Utility
- FM+ Configuration Tools
- FMx Configuration Tools
- Tranceiver IC Configuration Tool
- USB EZ-PD™ Configuration Utility
- USB EZ-PD™ Dock Configuration Utility
- USB EZ-USB™ HX3C Blaster Plus Configuration Utility
- USB UART Config Utility
- XENSIV™ Tire Pressure Sensor Programming
- Overview
- EZ-PD™ CCGx Dock Software Development Kit
-
FMx Softune IDE
- Overview
- RealOS™ Real-Time Operating System
- Softune IDE Language tools
- Softune Workbench
- Tool Lineup for F2MC-16 Family SOFTUNE V3
- Tool Lineup for F2MC-8FX Family SOFTUNE V3
- Tool Lineup for FR Family SOFTUNE V6
- Virtual Starter Kit
- Windows 10 operation of released SOFTUNE product
- Windows 7 operation of released SOFTUNE product
- Windows 8 operation of released SOFTUNE product
- ModusToolbox™ Software
- PSOC™ Creator Software
- Radar Development Kit
- RUST
- USB Controllers SDK
- Wireless Connectivity Bluetooth Mesh Helper Applications
- XMC™ DAVE™ Software
- Overview
- AIROC™ Bluetooth® Connect App Archive
- Cypress™ Programmer Archive
- EZ-PD™ CCGx Power Software Development Kit Archive
- ModusToolbox™ Software Archive
- PSOC™ Creator Archive
- PSOC™ Designer Archive
- PSOC™ Programmer Archive
- USB EZ-PD™ Configuration Utility Archives
- USB EZ-PD™ Host SDK Archives
- USB EZ-USB™ FX3 Archive
- USB EZ-USB™ HX3PD Configuration Utility Archive
- WICED™ Smart SDK Archive
- WICED™ Studio Archive
- Overview
- Infineon Developer Center Launcher
- Infineon Register Viewer
- Pin and Code Wizard
- Timing Solutions
- Wireless Connectivity
- LATEST IN
- Support
- Training
- Developer Community
- News
Business & Financial Press
Dec 04, 2025
Business & Financial Press
Dec 03, 2025
Business & Financial Press
Dec 02, 2025
Business & Financial Press
Nov 17, 2025
- Company
- Our stories
- Events
- Press
- Investor
- Careers
- Quality
- Latest news
Business & Financial Press
Dec 04, 2025
Business & Financial Press
Dec 03, 2025
Business & Financial Press
Dec 02, 2025
Business & Financial Press
Nov 17, 2025
- We help in bringing a meaningful and powerful trapped-ion quantum computer (TIQC) to life to solve the optimization problems that have been waiting for decades to be solved.
- We help our academic partners to focus on what they do best: push the boundaries of science and research.
- We help our startup partners to focus on what they do best: find new ways and integrate them into a successful and winning system.
We know how to industrialize and combine novel materials and technologies. Infineon traps and trap designs are predictable, repeatable and reliable. We’re paving the road towards thousands of qubits by working with our partners on cryogenic control electronics and optics integration. To that end, we verify and characterize our ion trap modules in our in-house quantum laboratory.
At our Villach fab we are capable of working with wafer diameters from 6 to 12 inch, many different substrates, and a broad variety of process materials.
Therefore, we can meet the particular needs of trapped ion quantum processors in terms of substrate materials, metal properties, and surface conditioning, supporting our academic partners in pushing the boundaries of science and research.
So far, Infineon ion traps with a storage capacity of 18 ions have demonstrated parallel shuttling of two ion-arrays. In order to arrive at high qubit counts of 100 or more, it’s all about scalability and further improving stability. Physics has come a long way. With each step we take in scaling, we have to solve the myriad of engineering challenges that come with it. We’re working with our academic and start-up partners on cryogenic control electronics and optics integration to pave the road towards thousands of qubits.
Find out more about quantum computing
Infineon is now into Gen.3 of their ion traps. It adds electrodes in the third dimension to increase ion confinement by a factor of ten compared to standard surface traps.
It is manufactured using Infineon's ample experience in anodic wafer bonding assuring industry leading precision. The trap has been successfully tested at the TIQI group at ETHZ and documented in this free paper.
To enable fast progress, the ion trap on carrier is installed into the ion trap socket as a defined and stable element to be in turn mounted into the cryostat or vacuum chamber. Fast-paced evolution will happen on the ion trap chip, whilst the socket will only evolve slowly.
To facilitate scaling, the ion trap on carrier will evolve into a Quantum Processing Module (QPM) that integrates control electronics and optics. Some of the electronic components currently positioned on the socket PCB will integrate onto the QPM. Our socket has been successfully employed by our academic partners.
To move to higher numbers of qubits, the integration of control electronics into the QPM is essential. This includes Digital-to-Analogue-Converters (DACs) and other components. The DACs are the most obvious: As with increasing qubit count, more of the electrodes that trap and move the ions are needed, and their voltages have to be generated close to the ion trap. Therefore, these components will have to operate at a temperature of around 10K.
Single ions are created by local ionization of neutral atoms, for example Ca, Ba or Be. Since ions are charged, they are controllable by electric fields and can be used for fundamental research as atomic clocks, sensors or for quantum computing.
Trapped ion benefits include
- Highest gate fidelities
- Full connectivity between qubits
- Longest coherence time
- Most entangled qubits: 24*
- Moderate temperature: 10K
- Shuttling capability
In a trapped ion quantum computer (TIQC) the qubits are implemented using charged atoms in a cryogenic vacuum. The ion, for example Ca+, Ba+ or Be+, is captured with DC and RF fields and manipulated with lasers or microwaves.
The qubit is defined by the electron‘s quantum-mechanical state: the ground state is defined as a logical 1, the qubit laser or a microwave pulse elevates the electron into an excited state to implement a logical 0.
Then after the calculations or gate operations have been performed, the resulting state of the qubit has to be read. That is done by employing the readout laser to elevate the electron to a higher electron orbit from which it will immediately decay and emit one photon that can be detected. Since the readout laser is tuned to excite the ground state, detected photons indicate that the qubit was a logical 1 before the readout.
Shuttling of ions provides the means to bring arbitrary combinations of qubits together for calculations. Therefore, it constitutes an important ingredient towards large-scale trapped-ion quantum processors.
Employing Infineon’s ion trap chip, scientists at the University of Innsbruck have been the first to demonstrate parallel shuttling of two ion chains.
Read more about 2D Linear Trap Array for Quantum Information Processing
This video demonstrates an array of 2x2 ions being transported simultaneously (low speed shuttling on purpose).
ATIQ (Implementierung von Quantenalgorithmen aus Finanzwesen und Chemie auf einem Quantendemonstrator):
More information
OptoQuant:
More information
On June 26th Infineon and eleQtron announced their partnership to jointly develop trapped ion Quantum Processor Units (QPUs) for scalable quantum computers.
In this collaboration, Infineon will provide eleQtron with three progressively improved generations of ion traps as well as the necessary expertise to adapt them to the MAGIC concept. Additionally, Infineon will enable eleQtron to build ion trap-based quantum computers with successively increasing functionality.
Press Releases
Press Releases
On July 6th Oxford Ionics and Infineon announced a collaboration to build high-performance and fully integrated quantum processing units (QPUs).
In this partnership, Infineon contributes their advanced technology platform for customized traps that are predictable, repeatable, and reliable in order to pave the way towards the industrial production of QPUs offering hundreds of qubits within the next five years .
Browse our open positions and become part of our team! Participate in further developing the future of quantum computing.
Follow this link and type 'quantum computing' in the search field
So far, Infineon ion traps with a storage capacity of 18 ions have demonstrated parallel shuttling of two ion-arrays. In order to arrive at high qubit counts of 100 or more, it’s all about scalability and further improving stability. Physics has come a long way. With each step we take in scaling, we have to solve the myriad of engineering challenges that come with it. We’re working with our academic and start-up partners on cryogenic control electronics and optics integration to pave the road towards thousands of qubits.
Find out more about quantum computing
Infineon is now into Gen.3 of their ion traps. It adds electrodes in the third dimension to increase ion confinement by a factor of ten compared to standard surface traps.
It is manufactured using Infineon's ample experience in anodic wafer bonding assuring industry leading precision. The trap has been successfully tested at the TIQI group at ETHZ and documented in this free paper.
To enable fast progress, the ion trap on carrier is installed into the ion trap socket as a defined and stable element to be in turn mounted into the cryostat or vacuum chamber. Fast-paced evolution will happen on the ion trap chip, whilst the socket will only evolve slowly.
To facilitate scaling, the ion trap on carrier will evolve into a Quantum Processing Module (QPM) that integrates control electronics and optics. Some of the electronic components currently positioned on the socket PCB will integrate onto the QPM. Our socket has been successfully employed by our academic partners.
To move to higher numbers of qubits, the integration of control electronics into the QPM is essential. This includes Digital-to-Analogue-Converters (DACs) and other components. The DACs are the most obvious: As with increasing qubit count, more of the electrodes that trap and move the ions are needed, and their voltages have to be generated close to the ion trap. Therefore, these components will have to operate at a temperature of around 10K.
Single ions are created by local ionization of neutral atoms, for example Ca, Ba or Be. Since ions are charged, they are controllable by electric fields and can be used for fundamental research as atomic clocks, sensors or for quantum computing.
Trapped ion benefits include
- Highest gate fidelities
- Full connectivity between qubits
- Longest coherence time
- Most entangled qubits: 24*
- Moderate temperature: 10K
- Shuttling capability
In a trapped ion quantum computer (TIQC) the qubits are implemented using charged atoms in a cryogenic vacuum. The ion, for example Ca+, Ba+ or Be+, is captured with DC and RF fields and manipulated with lasers or microwaves.
The qubit is defined by the electron‘s quantum-mechanical state: the ground state is defined as a logical 1, the qubit laser or a microwave pulse elevates the electron into an excited state to implement a logical 0.
Then after the calculations or gate operations have been performed, the resulting state of the qubit has to be read. That is done by employing the readout laser to elevate the electron to a higher electron orbit from which it will immediately decay and emit one photon that can be detected. Since the readout laser is tuned to excite the ground state, detected photons indicate that the qubit was a logical 1 before the readout.
Shuttling of ions provides the means to bring arbitrary combinations of qubits together for calculations. Therefore, it constitutes an important ingredient towards large-scale trapped-ion quantum processors.
Employing Infineon’s ion trap chip, scientists at the University of Innsbruck have been the first to demonstrate parallel shuttling of two ion chains.
Read more about 2D Linear Trap Array for Quantum Information Processing
This video demonstrates an array of 2x2 ions being transported simultaneously (low speed shuttling on purpose).
ATIQ (Implementierung von Quantenalgorithmen aus Finanzwesen und Chemie auf einem Quantendemonstrator):
More information
OptoQuant:
More information
On June 26th Infineon and eleQtron announced their partnership to jointly develop trapped ion Quantum Processor Units (QPUs) for scalable quantum computers.
In this collaboration, Infineon will provide eleQtron with three progressively improved generations of ion traps as well as the necessary expertise to adapt them to the MAGIC concept. Additionally, Infineon will enable eleQtron to build ion trap-based quantum computers with successively increasing functionality.
Press Releases
Press Releases
On July 6th Oxford Ionics and Infineon announced a collaboration to build high-performance and fully integrated quantum processing units (QPUs).
In this partnership, Infineon contributes their advanced technology platform for customized traps that are predictable, repeatable, and reliable in order to pave the way towards the industrial production of QPUs offering hundreds of qubits within the next five years .
Browse our open positions and become part of our team! Participate in further developing the future of quantum computing.
Follow this link and type 'quantum computing' in the search field
- Infineon teams up with eleQtron to deliver three generations of trapped-ion quantum processor units
- Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
- Infineon and Quantinuum announce partnership to accelerate quantum computing towards meaningful real-world applications
- Quantum computers: New Infineon quantum test lab boosts research
- Infineon opens laboratory for quantum electronics and Power AI
- Infineon partners with Nu Quantum, University of Sussex and Cisco
- Infineon Innovation Impact Video: Quantum Computing: What & When
- Munich Quantum Valley (MQV)
- Quantum Valley Lower Saxony (QVLS)
- German Quantum Computer based on Superconducting Qubits (GeQCoS)
- Digital-Analog Quantum Computer (DAQC)
- Semiconductor Quantum Processor with Shuttling-Based Scalable Architecture (QUASAR)
- Quantum Large-Scale Integration with Silicon (QLSI)
- European Project ISOLDE