Features, Benefits, and Applications

The TOLx package family - Infineon's power MOSFETs in TOLL, TOLG, and TOLT

Key features

  • Low RDS(on)
  • High current rating
  • Lower ringing and voltage overshoot compared to D²PAK

Key benefits

  • Reduction in conduction losses
  • High power density
  • System efficiency
  • Extended liftime 
  • High efficiency by lower switching losses and lower EMI

Target applications

TOLL package

Infineon package image TOLL MOSFET
  • Key feature: 60% board space reduction compared to D²PAK 7-pin
  • Key benefit: High power density

TOLG package

Infineon package image TOLG MOSFET
  • Key feature: 60% board space reduction compared to D²PAK 7-pin
  • Key benefit: High power density and superior thermal cycling on board (TCoB) performance

TOLT package

Infineon package image TOLT MOSFET
  • Key feature: Top-side cooling negative stand-off
  • Key benefit: Excellent thermal performance minmizing thermal resistance to heatsink