Discover PQFN 8x6: the latest high performance, high current and high power-density package solution – TOLL performance in half the package size
PQFN 8x6 package
Addressing the growing market need for high-performance, high current and high-power density applications
The new PQFN 8x6 is a high performance clip-based package optimized to handle very high currents up to 650 A, with significant increase in power density and a substantial reduction in footprint.
A footprint reduction of >50 percent compared to TOLL, together with a height reduction of 100 percent, results in an overall space saving of >70 percent enabling much more compact designs.
The seamless backward compatibility of this package with PQFN 5x6 enables power scalability of the same board or enable less paralleling of MOSFETs (ex: replace two PQFN 5x6 with one PQFN 8x6 solution).
Key features
High current capability in a compact 8.0x6.0 mm2 footprint
Industry's lowest RDS(on) and FOM
Leadless package with ultra-low package parasitics (resistance and inductance)
Latest OptiMOS™ MOSFET technology
Footprint compatibility with PQFN 5x6
Key benefits
Increased power density allows higher power designs in a compact board space
Very low conduction losses, low thermals and less device paralleling
Low EMI
Delivers benchmark performance with best-in-class power density and power efficiency
Simpler PCB design with scalability across various power levels
