Journal Articles

  • Optimal Periodic Variable Switching PWM for Harmonic Performance Enhancement in Grid-Connected Voltage Source Converters: Y. Wu, J. Xu, T. Soeiro, M. Stecca, P. Bauer in IEEE Transactions on Power Electronics, vol. 37, no. 6, pp. 7247-7262, 2022, DOI 10.1109/TPEL.2022.3141268 [TUD]
  • Evaluating Cu printed Interconnects “Sinterconnects” versus Wire bonds for Switching Converters: N. Hasan, T. Polom, D. Holzmann, P. Malagò, A. Binder, A. Roshanghias in Electronics, vol. 11, no. 9, p. 1373, 2022, DOI 10.3390/electronics11091373, [SAL]
  • A humidity-induced novel failure mechanism in boost stage power converters: J. Leppänen, G. Ross, V. Vuorinen, J. Ingman, J. Jormanainen, M. Paulasto-Kröckel in Microelectronics Reliability, Vol. 123., 2021, DOI 10.1016/j.microrel.2021.114207 [ABB, AAU]  
  • Influence of Lateral Temperature Gradients on the Failure Modes at Power Cycling: X. Liu, E. Deng, H. Wang, C. Herrmann, T. Basler and J. Lutz in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 407-414, March 2021, DOI 10.1109/TCPMT.2021.3058201 [TUC]
  • Thermal and Spatial Resolution in Scanning Thermal Microscopy Images: A Study on the Probe's Heating Parameters: V. Leitgeb, K. Fladischer, R. Hammer, L. Mitterhuber, S. Defregger; F. Peter, A. Buerke, S. Defregger in Journal of Applied Physics, 2021, DOI 10.1063/5.0037983 [MCL, IFD]
  • Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging: A. Roshanghias, P. Malago,  J. Kaczynski, T. Polom, J. Bardong, D. Holzmann, M.-H. Malik, M. Ortner, C. Hirsch, A. Binder in Energies 2021, Villach, Austria, DOI 10.3390/en14082176 [SAL]
  • A decision-making framework for dynamic scheduling of Cyber-Physical Production Systems based on digital twins: A. Villalonga, E. Negri, G. Biscardo, F. Castano, R. E. Haber, L. Fumagalli, M. Macchi in Annual Reviews in Control, United Kingdom, 2021, DOI 10.1016/j.arcontrol.2021.04.008 [CSIC]
  • Towards sustainability of manufacturing processes by multi-objective optimization: A case study on a submerged arc welding process: D. Rivas R. Quiza, M. Rivas, R. E. Haber in IEEE Access, Institute of Electrical and Electronics Engineers Inc., United States, 2020, DOI 10.1109/ACCESS.2020.3040196 [CSIC]
  • Quality monitoring of complex manufacturing systems on the basis of model driven approach: F. Castaño, R. E. Haber, W. M. Mohammed, M. Nejman, A. Villalonga, J. L. Martinez Lastra in Smart Structures and Systems, Volume 26 Issue 4, Korea, 2020, DOI 10.12989/sss.2020.26.4.495 [CSIC]
  • Computer Vision System for Welding Inspection of Liquefied Petroleum Gas Pressure Vessels Based on Combined Digital Image Processing and Deep Learning Techniques: Yarens J. Cruz, M. Rivas, R. Quiza, G. Beruvides and R. E. Haber in Sensors, Special Issue Computer Vision for Remote Sensing and Infrastructure Inspection, Switzerland, 2020, DOI 10.3390/s20164505 [CSIC]
  • Control Strategies for Induction Motors in Railway Traction Applications: A. F. Abouzeid, J. M. Guerrero, A. Endemaño, I. Muniategui, D. Ortega, I. Larrazabal, F. Briz in Energies, Multidisciplinary Digital Publishing Institute (MDPI), Switzerland, February 2020, DOI 10.3390/en13030700 [UNIOVI, IPT]
  • Cloud-Based Industrial Cyber–Physical System for Data-Driven Reasoning: A Review and Use Case on an Industry 4.0 Pilot Line: A. Villalonga, G. Beruvides, F. Castaño, R. E. Haber in IEEE Transactions on Industrial Informatics, Institute of Electrical and Electronics Engineers, United States, 2020, DOI 10.1109/tii.2020.2971057 [CSIC]
  • Digital Twin-Based Optimization for Ultraprecision Motion Systems With Backlash and Friction: R. H. Guerra, R. Quiza, A. Villalonga, J. Arenas, F. Castano in IEEE Access, Institute of Electrical and Electronics Engineers Inc., United States, 2019, DOI 10.1109/access.2019.2928141 [CSIC]

Publication in Conference Proceedings / Workshop

  • Data Analytics for Grid Resilience with Early Failures and Wear-out Failures: Robert Ross, Peter Ypma, Gerben Koopmans, IWO and TUD in IEEE SECON – September 2022, not yet published
  • Interface management concerning disruptions within supply chains: empirical evidence from the semiconductor industry during the COVID-19 pandemic: Przybysz, K.A., Lindner, F., Ismail, A., Ehm, H. and Keil, S., HSZG and IFAG, Berlin, Germany - 29 th EurOMA conference 2022, July 2022
  • Detecting Soldering Quality in Power Modules with Zth in the Loading Phase: Hao Wang, Jan Fuhrmann, Hans-Günter Eckel, UROS, Nürnberg, Germany - PCIM Europe 2022, May 2022
  • Interface Optimization Potentials Concerning Disruptions along the Semiconductor Value Chain: Kazimierz Przybysz, Fabian Lindner, Kevin Mühlan, Sophia Keil, HSZG , France - 20th European Advanced Process Control and Manufacturing (apc|m) Conference, Toulon, 4-6 April 2022
  • Weighted Linear Regression based Data Analytics for Decision Making after Early Failures: R. Ross, P. Ypma, G. Koopmans, IWO, TUD in IEEE PES, Brisbane, Australia – Hybrid Event, December 2021, not yet published
  • Power Function Algorithm for Linear Regression Weights with Weibull Data Analysis: R.Ross, IWO in International Advanced Computing Conference (IACC), Malta, not yet published
  • Experimental parameter identification and validation of a process model for ultrasonic heavy wire bonding: R. Schemmel, N. Müller, L. Klahold, T. Hemsel, W. Sextro, UPB in IMAPS 54th International Symposium on Microelectronics, San Diego, USA, October 2021
  • Calibration of electrothermal circuit model of power IGBT module: A. Chvala, J. Marek, P. Príbytný, J. Kozarik, D. Donoval, STUBA in 9th International Conference on Advances in Electronic and Photonic Technologies - ADEPT 2021, Podbanské, Slovakia, September 2021
  • A Review and Implementation Framework of Industrial Augmented Reality: K. Mühlan, K. Przybysz, F. Lindner, D. Akrmanova, D. Winkler, S. Keil, HSZG in 26th IEEE International Conference on Emerging Technologies and Factory Automation, Västerås, Sweden, September 2021
  • Learn to shape the digital transformation: the design approach of a learning factory for industrial engineers: F. Lindner, D. Winkler, K. Mühlan, U. Wendt, S. Keil, HSZG in CLF2021, 11th Conference on Learning Factories, not yet published
  • Techno-economical comparison between Si and SiC switches in a VIENNA rectifier: P. Korhonen, KEMPPI in ISIE2021, 30th International Symposium of Industrial, June 2021
  • Impacts of Different Charging Strategies on the Electric Vehicle Battery Charger Circuit Using Phase-Shift Full-Bridge Converter: Lyu, T. B. Soeiro, P. Bauer, TUD in IEE PEMC, 19th International Power Electronics and Motion Control Conference, Gliwice-Poland, April 2021
  • Virtual Resistor Active Damping with Selective Harmonics Control of LCL-Filtered VSCs: Wu, T. B. Soeiro, A. Shekhar, P. Bauer, TUD in IEE PEMC, 19th International Power Electronics and Motion Control Conference, Gliwice-Poland, April 2021
  • The influence of electrical stress on the distribution of electrically active defects in IGBT: Drobný, J. Marek, A. Chvála, J. Faraga, M. Jagelka, and L. Stuchlíková, STUBA, Powertec, 15th International Seminar On Power Semiconductors, January 2021
  • Methodology for multi-die package semiconductors: Thermal Model in a Dynamic Environment: M. Baron, X. Mo, P. Alou, M. Vasic; F. Vergara, P. J. Arnaiz, UPM and FAGOR in IWED 2021, 28th International Workshop on Electric Drives: Improving Reliability of Electric Drives, January 2021
  • Modified Adaptive Large Neighborhood Search for Scheduling Automated Guided Vehicle fleets considering dynamic transport carrier transfers: P. Boden, S. Rank, T. Schmidt, TUDD in Logistics Journal, December 2020
  • Si-Ti-W-AlCu thin film stacks investigated with SThM and TDTR for improved thermal management: Fladischer, V. Leitgeb, L. Mitterhuber and S. Defregger, MCL at at nanoFIS – Functional Integrated nanoSystems Conference, November 2020
  • Bump planarization to enhance Cu to Cu thermosonic flipchip bonding: Roshanghias and A. Rodrigues, SAL at Electronics System-Integration Technology Conference, Norway, September 2020
  • Fully Printed Planar Interconnect Technology for Power Module Packaging: Roshanghias and A. Rodrigues, MCL, SAL in ESTC 2020 at Electronics System-Integration Technology Conference, Norway, September 2020
  • Spatial and Thermal Resolution in SThM images: A Study on the Probe's Heating Parameters: Leitgeb, K. Fladischer, L. Mitterhuber, and S. Defregger, MCL at Therminic 2020, 26th International Workshop for Thermal Investigations of ICs and Systems: video conference, Berlin, September 2020
  • Assessing the Impact of Information Assistance Systems on a Worker Level. A Pre-Study towards an Evaluation Framework: F. Lindner, D. Winkler, A. Müller, K. Mühlan, S. Keil, HSZG in MuC 2020, Mensch und Computer, September 2020, DOI: 10.18420/muc2020-ws116-001
  • Finding solder cavities in high power modules with temperature sensitive parameters: Fuhrmann, S. Klauke, H.-G. Eckel, UROS and IFAG at PCIM Europe, digital event, July 2020
  • Influence of the gate driver circuit and common source inductance on the short circuit type II & III behavior of IGBT modules and protection: Xing L., C. Herrmann, C. Bäumler, J. Kowalsky, J. Lutz, TUC at PCIM Europe, digital event, July 2020
  • Local Decision Making based on Distributed Digital Twin Framework: Villalonga, E. Negri, L. Fumagalli, M. Macchi, F. Castaño, R. Haber, CSIC at 1st Virtual IFAC World Congress, Berlin, July 2020
  • Digital twin-based Optimization on the basis of Grey Wolf Method. A Case Study on Motion Control Systems: F. Castaño, R. Haber, S. Strzelczak, Z. Miljković, L. Fumagalli, M. Petrović, CSIC in IEEE International Conference on Industrial Cyber-Physical Systems 2020 (ICPS), Tampere, Finland, Online, June 2020
  • Power cycling - methods, measurement accuracy, comparability: J. Lutz, TUC in CIPS 11th International Conference on Integrated Power Electronics Systems, March 2020
  • Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding: R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, UPB, IFAG (Warstein) in CIPS 11th International Conference on Integrated Power Electronics Systems, March 2020

Oral Presentations and others

  • Predictive Health Monitoring of Power Electronics using Machine Learning Techniques: Elena Blazhevska, VIF, Scuola di Ingegneria Industriale e dell’Informazione, Milano, Italy, Thesis/Dissertation, March 2022
  • Interface Optimization Potentials Concerning Disruptions along the Semiconductor Value Chain: K. Przybysz, F. Lindner, K. Mühlan, S. Keil, HSZG at the 20th European Advanced Process Control and Manufacturing Conference (apc|m), not yet published
  • "SPEEDING UP AN ENDURANCE TEST OF AN IGBT MODULE IN SWITCHED-MODE POWER CYCLING": Eemeli Kettunen, KEMPPI, Lappeenranta-Lahti University of Technology LUT, Lappeenranta, Finnland, Thesis/Dissertation, December 2021
  • Power Electronics Building Block: Development and validation for Traction Converters: IPT at RailLive! Conference, Madrid, November 2021
  • Combined Simulation of Electrical and Ageing Behaviour of Li – Ion Automotive Batteries: Lorenzo Milanesi, Università degli Studi di Modena e Reggio Emilia, VIF, IECON‘ 21 - 47th Annual Conference of the IEEE Industrial Electronics Society (13.-16. October 2021), Modena, Italy
  • Lotfehlstellen im Leistungsmodul mit Hilfe einer Zth-Messung erkennen: Fuhrmann, H. Wang, H.-G. Eckel, UROS, Leistungshalbleiterkolloquium, Freiburg, October 2021
  • Measuring the junction temperature of IGBT module during switched-mode power cycling: Simpanen, KEMPPI, Master´s thesis, June 2021
  • IGBT Structure Function Evaluation Method in Combined Power- and Temperature Cycle Test: Forsström, ABB, AAU, Master´s thesis, May 2021
  • Foundry Process for Integrated Galvanic Isolation: XFAB-DD, 15th Silicon Saxony Day, Online, May 2021
  • Power2Power General Overview: Pyper, IFD, EFECS, November 2020
  • Si-Ti-W-AlCu thin film stacks investigated with SThM and TDTR for improved thermal management: Fladischer, V. Leitgeb, L. Mitterhuber and S. Defregger, MCL at at nanoFIS – Functional Integrated nanoSystems Conference, November 2020
  • Finding solder cavities in high power modules with temperature sensitive parameters: Fuhrmann, S. Klauke, H.-G. Eckel, UROS and IFAG at PCIM Europe, digital event, July 2020
  • Influence of the gate driver circuit and common source inductance on the short circuit type II & III behavior of IGBT modules and protection: Xing L., C. Herrmann, C. Bäumler, J. Kowalsky, J. Lutz, TUC, Online, July 2020
  • Local Decision Making based on Distributed Digital Twin Framework: Villalonga, E. Negri, L. Fumagalli, M. Macchi, F. Castaño, R. Haber, CSIC, 1st Virtual IFAC World, Online, July 2020Control Strategies for Induction Motors in Railway Traction Applications: UNIOVI, IPT, 2020: LinkedIn
  • Control Strategies for Induction Motors in Railway Traction Applications: UNIOVI, IPT, 2020: LinkedIn
  • Digital twin-based Optimization on the basis of Grey Wolf Method. A Case Study on Motion Control Systems: F. Castaño, R. Haber, S. Strzelczak, Z. Miljković, L. Fumagalli, M. Petrović, CSIC, IEEE International Conference on Industrial Cyber-Physical Systems (ICPS), 2020
  • Complementary SThM and TDTR characterization of Si-Ti-TiN-W-Al thin films for improved thermal management in future transistor technology: K. Fladischer, V. Leitgeb, L. Mitterhuber, S. Defregger, MCL in International Conference and Exhibition on Thermal & Power solutions (IMAPS), online, 2020
  • Rostocker Elektrotechniker nehmen neuen Prüfplatz zur Vermessung von Leistungshalbleitern in Betrieb: J. Furhmann, UROS, press release, 2020
  • European research project Power2Power for more efficient power semiconductors launches in Dresden: Infineon, press release, 2019
  • Work in Power2Power: M. Leibl, U. Grossner, BRUSA, ETH in Innosuisse Magazine, 2019
  • Work in Power2Power: UROS in Power Electronics Colloquium (Leistungselektronik-Kolloquium-Nord), Rostock, 2019
  • Power2Power General Overview: O. Pyper, IFD, EFECS, Helsinki, 2019
  • Work in Power2Power: UROS in On-site Research Campus, Rostock, 2019
  • Work in Power2Power: SAL in ECSEL Austria conference, Graz, 2019
  • CSIC contributions to Power2Power project: CSIC in Madrid Open Science and Innovation Week, 2019
  • Experimentelle Analyse und Modellierung des Verbindungsaufbaus beim Ultraschall-Dickdrahtbonden: C. Scheidemann, R. Schemmel, T. Hemsel, O. Kirsch, W. Sextro, UPB, IFAG in IMAPS autumn conference, Munich, 2019
  • Lotfehlstellen - elektrisch über temperatursensitive Parameter messbar / eng. "solder faults: electrically measurable via temperature-sensitive parameters": UROS in Power semiconductor colloquium, Freiburg, 2019
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