What to expect

You can look forward to several highlights at our forum:

• Technology expert session: Learn about upcoming package innovations like new design opportunities using QDPAK top-side cooling and its functional integration. Get insights into power cycling aspects when using SiC or make yourself familiar with the latest reliability aspects and chip technology like the enhanced Gen1 CoolSiC™ devices.
• Application insights: What makes CoolSiC™ and CoolGaN™ the perfect solutions for applications like on-board chargers, telecom and server SMPS, or low-power drives? We will demonstrate use cases that have already leveraged the advantages of SiC and GaN. You will get concrete hints to improve motor system performance using CoolGaN™ in Field Oriented Control motor drives and more.
• Customer cases: Do not miss the presentation from Siemens Mobility GmbH for insights into the advantages of using SiC in railway traction converters! For our panel discussion, we are honored to welcome Delta Energy Systems (Germany) GmbH. They will talk about the trends in wide-bandgap power devices for on-board chargers together with our GaN expert Dr. Gerald Deboy.

 

• Get answers to these questions (exemplary):

  • What are the highlights of Infineon’s recent product releases?

  • How to operate WGB devices successfully in my system?

  • What is the technical advantage of WBG components in selected applications?

  • What are the typical power cycling failure modes for SiC? 
    
    
  • How can the power cycling curve be interpreted?