Publications

S. Ostermann, M. Janetschek, R. Prodan and T. Fahringer
Scientific Applications on Clouds
University of Innsbruck, Innsbruck, Austria
In Nelson Fonseca and Raouf Boutaba, Cloud Services, Networking and Management, 311-330, April, 2015, Wiley 

A. Iosup, R. Prodan and D. Epema
Cloud Computing for Data-Intensive Applications
University of Innsbruck, Innsbruck, Austria
In Xiaolin Li and Judy Qiu (Eds.), Cloud Computing for Data-Intensive Applications, 83-104, November, 2014, Springer

E. Gruenwald (1), J. Rosc (1), R. Hammer (1), S. Defregger (1), J. Kraft (3), M. Hofstaetter (3) M. Koch (2) and R. Brunner (1)
Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy
(1) Material Center Leoben Forschungs GmbH (MCL), Leoben, Austria
(2) PVA TePla Analytical System GmbH (PVA TePla), Aalen, Germany
(3) Austriamicrosystems AG (AMS), Unterpremstaetten, Austria
Peer reviewed Journal: Special Issue of Microelectronics Reliability (MR), 370-374, September 2016

E. Gruenwald (1), R. Hammer (1), J. Rosc (1), G.A. Maier (1), M. Barnthaler (2), M.J. Cordill (2), S. Brand (3), R. Nuster (4), T. Krivec (5) and R. Brunner (1)
Advanced 3D Failure Characterization in Multi-Layered PCBs
(1) Materials Center Leoben Forschung GmbH (MCL), Leoben, Austria
(2) Erich Schmid Institute of Materials Science (ESI), Austrian Academy of Sciences and Department of Material Physics, Montanuniversitaet Leoben, Austria
(3) Fraunhofer Institute for Microstructure of Materials and Systems (IMWS), Halle, Germany
(4) Institute for Experimental Physics, Karl-Franzens University, Graz, Austria,
(5) Austria Technologie & Systemtechnik AG (AT & S), Leoben, Austria
International Journal Independent Nondestructive Testing and Evaluation (NDT \& E International), Volume 84, 99-107, December 2016

D. Simon, C. Boianceanu, G. De Mey, V. Ţopa and A. Spitzer
Reliability Analysis for Power Devices which Undergo Fast Thermal Cycling
Infineon Technologies Romania&Co.Societate in Comandita Simpla, Romania
IEEE Transactions on Device and Materials Reliability, Volume: 16, Issue: 3, 336 – 344, September 2016 

A. Ochoa Brezmes and C. Breitkopf
Mechanical Analysis of Wafer Testing with FEM Simulations (Part I and II)
Institut fuer Energietechnik, Fakultaet fuer Maschinenwesen, Technische Universitaet Dresden, Dresden, Germany
International Journal of Microelectronics Reliability,166-182, August 2016 

A. Ochoa Brezmes, C. Breitkopf, G. Reuther, A. Gneupel
Characterization of critical conditions during wafer testing by FEM and experiments
Institut fuer Energietechnik, Fakultaet fuer Maschinenwesen, Technische Universitaet Dresden, Dresden, Germany,Materials Science in Semiconductor Processing, 2017

M. Omazic (1), D. Tscharnuter (1), G. Oreski (1), M. Pinczolits (2), N. Nikac (2), A. Rappmund (3), M. Erceg (4), G. Pinter (5)
Optimum Chip-Tape Adhesion for Reliable Pick-up Process
(1) Polymer Competence Center Leoben GmbH, Leoben, Austria
(2) Infineon Technologies Austria AG, Villach, Austria
(3) Infineon Technologies AG, Neubiberg, Germany
(4) Department of Organic Technology, Faculty of Chemistry and Technology, University of Split, Split, Croatia
(5) Department of Polymer Engieering and Science, Montanuniversitaet Leoben, Leoben, Austria
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017 

E. Lackner et al.
CMOS integrated SnO2 thin film gas sensors functionalized with Pt nanoparticles utilizing a magnetron sputtering-based gas-phase synthesis approach
Materials Center Leoben, Austria
Submitted for publication Nanotechnology 2017

R. Wimmer-Teubenbacher et al.
CO2 gas sensors based on functionalized CMOS-integrated CuO-nanowire arrays
Materials Center Leoben, Austria
To be submitted for publication in Sensors and Actuators B 2017

E. Gruenwald (1), R. Nuster (2), R. Treml (3), D. Kiener (3), G. Paltauf (2) and R. Brunner (1)Laser Ultrasonic Characterization of Thin Films
(1) Materials Center Leoben, Austria
(2) University of Graz, Austria
(3) Department Materials Physics, Montanuniversitaet Leoben, Austria
1st International Conference on Functional Integrated nano Systems / Materials Today, December 3-5, 2014, Graz, Austria

E. Gruenwald (1), R. Nuster (2), R. Treml (3), D. Kiener (3), G. Paltauf (2) and R. Brunner (1
Contactless Elastic Constants Characterization of Tungsten Thin Films via Laser Ultrasound
(1) Materials Center Leoben, Austria
(2) University of Graz, Austria
(3) Department Materials Physics, Montanuniversitaet Leoben, Austria
1st International Conference on Functional Integrated nano Systems, December 3-5, 2014, Graz, Austria

A. Rastogi (1), N. Morin (1), C. Jones (1), S. Burgess (1), R. Trowell (1), C. Widdicks (1), I. Moncrieff (1), M. Ehmann(2), S. Schmidbauer (3)
Productivity Challenges in PVD Processing in 300mm Pilot Lines for Power semiconductors – Equipment Reliability and Productivity Enhancements
(1) SPTS Technologies Ltd, Newport, UK
(2) Infineon Technologies, Villach Austria
(3) Infineon Technologies, Dresden, Germany
26th SEMI Advanced Semiconductor Manufacturing Conference, May 3-6, 2015, Saratoga Springs, New York

J. Marek, L. Stuchlíková, D. Donoval, A. Chvála, M. Molnár and P. Pribytny
Computer Modelling and Simulation of Power MOSFET Properties in Interactive E-Learning Course
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava, Slovakia,International Conference on Distance Learning, Simulation and Communication, May 19-21, 2015, Brno, Czech Republic

Ch. Taudt (1,2), A. Augenstein (3), T. Baselt (1), H. Assmann (4), A. Greiner (4), E. Koch (2) and P. Hartmann (1)
Characterization of a dispersion-controlled approach to surface profilometry on wafers using a white-light interferometer
(1) University of Applied Sciences Zwickau, Zwickau, Germany
(2) Medizinische Fakultaet Carl Gustav Carus, Technische Universitaet Dresden, Germany
(3) University of Pittsburgh, Swanson School of Engineering, Pittsburgh, PA, USA
(4) Infineon Technologies Dresden GmbH, Dresden, Germany
SPIE Mircotechnologies, May 4-6, 2015, Barcelona, Spain

D. Doleschal and G. Weigert
Scheduling under Consideration of the Machine Capability
Technische Universitaet Dresden, Germany
16th ASIM Dedicated Conference “Simulation in Production and Logistics”, September 23-25, 2015, Dortmund, Germany

P. Príbytný, M. Molnár, M. Mikolášek, D. Hurban, A. Chvála, J. Marek, and D. Donoval
2-D Simulation and Analysis of Schottky Contacts for Optimum Performance of Thin-Film Silicon Solar Cells
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava, Slovakia
3rd International Conference on Advances in Electronic and Photonic Technologies, June 1-4, 2015, High Tatras, Slovakia

H. Mahmoudi and H. Zimmermann
On Optimal Latin Hypercube Design for Yield Analysis of Analog Circuits
Technische Universitaet Wien, Vienna, Austria
23rd Austrian Workshop on Microelectronics, September 28,2015, Vienna, Austria

A. Munding (1), M. Gruber (1), T. Both (1), M. Herfurth (2), T. Hammer (2), D. Schweitzer (2), K. Pressel (1), A. Waldschick (3), E. Baur (3) and A. Kaltenbacher (3)
Thermal Improvement of Plastic Laminate Based LED Modules with Embedded Chips
(1) Infineon Technologies AG, Regensburg, Germany
(2) Infineon Technologies AG, Munich, Germany
(3) Osram GmbH, Regensburg, Germany
20th European Microelectronics and Packaging Conference, September 14-16, 2015, Friedrichshafen, Germany

P. Príbytný, M. Molnár, A. Chvála, J. Marek, M. Mikolášek and D. Donoval
TCAD Simulation Methodology for Advanced 3-D Electro-Physical and Optical Analysis
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava, Slovakia
20th International Conference on Simulation of Semiconductor Processes and Devices, September 9-11, 2015, Washington DC, USA

D. Doleschal (1), G. Weigert (1) and A. Klemmt (2)
Yield Integrated Scheduling Using Machine Condition Parameter
(1) TU Dresden, Germany
(2) Infineon Technologies Dresden, Germany
Winter Simulation Conference, December 6-9, 2015, Huntington Beach, CA, USA

Ch. Taudt (1,2,3), T. Baselt (1,3), B. Nelsen (1), H. Aßmann (4), A. Greiner (4), E. Koch (2) and P. Hartmann (1,3)
Two-dimensional low-coherence interferometry for the characterization of nanometer-wafer-topographies
(1) University of Applied Sciences Zwickau, Germany
(2) Medizinische Fakultaet Carl Gustav Carus, Technische Universitaet Dresden, Germany
(3) Fraunhofer-Institut fuer Werkstoff- und Strahltechnik IWS, Dresden, Germany
(4) Infineon Technologies Dresden GmbH, Germany
SPIE Photonics Europe 2016, April 4-7, 2016, Brussels, Belgium

A. Mann (1), H. Lohmeyer (1), Y. Joseph (2)
Low-cycle fatigue of multilayer metal stack employed as fast wafer level monitor for backend integrity in smart power technologies
(1) Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
(2) Technische Universitaet Bergakademie Freiberg, Institute of Electronic and Sensor Materials, Germany
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, April 17-20, 2016, Montpellier, France

N. Mitrovic, R. Enne and H. Zimmermann
A Bootstrap Circuit for DC–DC Converters with a Wide Input Voltage Range in HV-CMOS
Vienna University of Technology, Austria
39th International Convention on Information and Communication Technology, Electronics and Microelectronics, May 30-June 3, 2016, Opatija, Croatia

H. Hackl (1) and B. Auinger (2)
Calculation of Very Near Field Radiated Emission of a Straight Cable Harness
(1) NXP Semiconductors Austria, Gratkorn, Austria
(2) Institute of Electronics, Graz University of Technology, Graz, Austria
12th Conference on PhD Research in Microelectronics and Electronics, June 27-30, 2016, Lisbon, Portugal

A. Chvála, J. Marek, P. Príbytný and D. Donoval
Advanced 3-D Device and Circuit Electrothermal Simulations of Power Integrated Circuits
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava
ESSDERC 2016, September 12-15, 2016, Lausanne, Switzerland

E. Gruenwald (1), H. Aßmann (2), R. Nuster (3), R. Hammer (1), G. Paltauf (3), R. Brunner (1)
Characterization of Polyimid-Multi-Layer Thin Films Combining Laser Ultrasonic Measurements and Numerical Evaluations
(1) Materials Center Leoben (MCL), Austria
(2) Infineon Dresden GmbH, Germany
(3) Karl-Franzens University of Graz, Austria
Eurosim Congress on Modelling and Simulation, September 12-16, 2016, Oulu, Finland

M. Kollmitzer (1), M. Olbrich (2), E. Barke (2)
A CAD Framework for Circuit Simulation of Substrate Minority Carrier Injection for Smart Power ICs
(1) Infineon Technologies Austria AG, Villach, Austria
(2) Institute of Microelectronic Systems, Leibniz Universitaet Hannover, Hannover, Germany
35th International Conference on Computer Aided Design, November 7-10, 2016, Austin, TX, USA

Ch. Taudt (1,2,3), T. Baselt (1,3), B. Nelsen (1), H. Aßmann (4), A. Greiner (4), E. Koch (2) and P. Hartmann (1,3)
Measurement of surface topographies in the nm-range for power chip technologies by a modified low-coherence interferometer
(1) University of Applied Sciences Zwickau, Germany
(2) Medizinische Fakultaet Carl Gustav Carus, Technische Universitaet Dresden, Dresden, Germany
(3) Fraunhofer-Institut fuer Werkstoff- und Strahltechnik IWS, Dresden, Germany
(4) Infineon Technologies Dresden GmbH, Dresden, Germany
SPIE Photonics West, February 13-18, 2016, San Francisco, CA, USA

H. Hackl (1) , G. Winkler (2) and B. Deutschmann (2)
Simulation of Radiated Emission during the Design Phase based on Scattering Parameter Measurement
(1) NXP Semiconductors Austria, Gratkorn, Austria
(2) Institute of Electronics, Graz University of Technology, Graz, Austria
10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, November 10-13, 2015, Edinburgh, Scotland 

E. Gruenwald (1), R. Nuster (2), S. Defregger (1), R. Brunner (1)
Laser Ultrasonic Characterization of Diverse Tungsten Stack Configurations
(1) Material Center Leoben Forschungs GmbH (MCL), Leoben, Austria
(2) Karl-Franzens Universitaet Graz, Austria
5th International Symposium on Laser-Ultrasonics and Advanced Sensing, July 4-8, 2016, Linz, Austria

S. Adams, A. Feustel, W. Sonnenmoser and J. Zaib
Data mining methods are able to unearth within FDC the key influencing factors affecting electrical parameters
Robert Bosch GmbH, Reutlingen
16th European Conference on Advanced Process Control and Manufacturing, April 11-13, 2016, Reutlingen, Germany

S. Ostermann, R. Prodan, F. Schueller and G. J. Mayr
Meteorological Applications utilizing Grid and Cloud Computing
University of Innsbruck, Innsbruck, Austria
3rd IEEE International Conference on Cloud Networking, October 8-10, 2014, Luxembourg, Luxembourg

H. Hackl (1) and B. Deutschmann (2)
A resources-optimized EMI receiver model
(1) NXP Semiconductors Austria, Gratkorn, Austria
(2) Institute of Electronics, Graz University of Technology, Graz, Austria
24th Austrian Workshop on Microelectronics, October 19, 2016, Villach, Austria

H. Lewitschnig (1), N. Haselgruber (2)
New Model for Stress Tests without Failures
(1) Infineon Technologies Austria AG, Villach, Austria
(2) CIS Consulting in Industrial Statistics GmbH, Haslach, Austria
Annual Reliability and Maintainability Symposium, January 23-26, 2017, Orlando, FL, USA

A. Chvála, P. Benko, P. Príbytný, J. Marek and D. Donoval
3-D Device and Circuit Electrothermal Simulations of Power Integrated Circuit Including Package
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava, Slovakia
11th International Conference on Advanced Semiconductor Devices And Microsystems, November 13-16, 2016, Smolenice, Slovakia

D. Doleschal (1), G. Nieke (1), G. Weigert (1) and A. Klemmt (2)
A CP Approach for Planning Lot Release Dates in a Supply Chain of Semiconductor Manufacturing
(1) Electronics Packaging Laboratory, Technische Universitaet Dresden, Germany
(2) Infineon Technologies Dresden GmbH
Winter Simulation Conference, December 11-14, 2016, Arlington, Virginia, USA

N. Mitrovic, R. Enne and H. Zimmermann
An integrated current sensing circuit with comparator function for a buck DC-DC converter in HV-CMOS
Technische Universitaet Wien, Vienna, Austria
23rd IEEE International Conference on Electronics, Circuits and Systems, December 11-14, 2016, Monte Carlo, Monaco

N. Mitrovic, R. Enne and H. Zimmermann
High-Efficiency CMOS Buck Converter with Wide Output Voltage Range
Technische Universitaet Wien, Vienna, Austria
24th Austrian Workshop on Microelectronics, October 19, 2016, Villach, Austria

E. Gruenwald (1), R. Nuster (2), G. Paltauf (2), T. Maier (3), R. Wimmer-Teubenbacher (1), R. Konetschnik (4), D. Kiener (4), V. Leitgeb (1), A. Koeck (1) and R. Brunner (1)
Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks
(1) Materials Center Leoben Forschung GmbH (MCL), Leoben, Austria
(2) Karl-Franzens University of Graz (KFU), Department of Experimental Physics, Graz, Austria
(3) Austrian Institute of Technology GmbH (AIT), Vienna, Austria
(4) Montanuniversitaet Leoben, Department of Material Physics, Leoben, Austria
3rd International Conference on Functional Integrated nano Systems, June 27-29, 2016, Graz, Austria

Ch. Taudt (1, 2, 3), T. Baselt (1, 3), B. Nelsen (1), H. Assmann (4), A. Greiner (4), E. Koch (2) and P. Hartmann (1, 3)
Evaluation of the thermal stability of a low-coherence interferometer for precision surface profilometry
(1) University of Applied Sciences Zwickau, Germany
(2) Medizinische Fakultaet Carl Gustav Carus, Technische Universitaet Dresden, Dresden, Germany
(3) Fraunhofer-Institut fuer Werkstoff- und Strahltechnik IWS, Dresden, Germany
(4) Infineon Technologies Dresden GmbH, Dresden, Germany
SPIE Photonics West, January 28-February 2, 2017, San Francisco, USA

H. Mahmoudi and H. Zimmermann
An Evolutionary Algorithm for Large-Scale Statistical Modeling of Integrated Circuits
Technische Universitaet Wien, Vienna, Austria
2nd International Conference on Micro-electronics Engineering, March 17-18,2017, Los Angeles, California, USA

H. Mahmoudi and H. Zimmermann
A New Sampling Technique for Monte Carlo-based Statistical Circuit Analysis
Technische Universitaet Wien, Vienna, Austria
Design, Automation and Test in Europe, March 27-31, 2017, Lausanne, Switzerland

Georg M. Reuther (1), Ivan Penjovic (1), Angel Ochoa Brezmes (2), Reinhard Pufall (1)
Analytical and simulation-based risk assessment of imprint depth and brittle fracture in bond pad stacks
(1) Infineon Technologies AG, Neubiberg, Germany
(2) Technische Universitaet Dresden, Institut fuer Energietechnik, Dresden, Germany
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, April 2-5, 2017, Dresden, Germany

R. Weissnegger, M. Schachner, C. Kreiner, M. Pistauer, K. Roemer, C. Steger
SaVeSoC - Safety Aware Virtual Prototype Generation and Evaluation of a System on Chip
CISC Semiconductor GmbH, Graz University of Technology
Spring Simulation Multi-conference - Mod4Sim, April 23-26, 2017, Virginia Beach, USA

H. Lewitschnig (1) and N. Haselgruber (2)
Reliability assessment of failure free stress tests
(1) Infineon Technologies Austria AG, Villach, Austria
(2) CIS Consulting in Industrial Statistics, Austria
ENBIS Spring Meeting, May 28-30, 2017, Schloegl, Austria

M. Kollmitzer, M. Olbrich and E. Barke
A Circuit Simulation Flow for Substrate Minority Carrier Injection for Smart Power ICs
Infineon Technologies Austria AG (IFAT)
29th International Symposium on Power Semiconductor Devices and IC's, May 28-June 1, 2017, Sapporo, Japan

Ch. Taudt (1, 2, 3), T. Baselt (1, 3, 4), B. Nelsen (1), H. Assmann (5), A. Greiner (5), E. Koch (2) and P. Hartmann (1, 3)
Characterization of batwing effects in precision low-coherence interferometry using broadband light sources
(1) University of Applied Sciences Zwickau, Leupold-Institute for Applied Natural Sciences (LIAN) / Optical Technologies, Zwickau, Germany
(2) Technische Universitaet Dresden, Medizinische Fakultaet Carl Gustav Carus, Dresden, Germany
(3) Fraunhofer-Institut fuer Werkstoff- und Strahltechnik IWS, Dresden, Germany
(4) Technische Universitaet Dresden, Fakultaet Maschinenwesen, Dresden, Germany
(5) Infineon Technologies Dresden GmbH, Dresden, Germany
SPIE Optical Metrology Conference, June 26-29, 2017, Munich, Germany

R. Weissnegger, M. Schuss, M. Schachner, C. Kreiner, M. Pistauer, K. Roemer, C. Steger
A Novel Simulation-based Verification Pattern for Parallel Executions in the Cloud
CISC Semiconductor GmbH, Graz University of Technology
22nd European Conference on Pattern Languages of Programs, July 12-16, 2017, Kloster Irsee in Bavaria, Germany 

E. Gruenwald, R. Hammer, J. Rosc, B. Sartory, R. Brunner
Accretion Detection via Scanning Acoustic Microscopy in Microelectronic Components - Considering Symmetry Breaking Effects
Materials Center Leoben Forschung GmbH, Leoben, Austria
M&M 2017 Annual Meeting (Microscopy & Microanalysis), August 6-10, 2017, St. Louis, USA 

H. Hackl (1) and B. Deutschmann (2)
Short Time Fourier Transformation in Frequency Domain to Process Very Long Time Domain Data
(1) NXP Semiconductors Austria, Gratkorn, Austria
(2) Institute of Electronics, Graz University of Technology, Graz, Austria
EMC Europe 2017, September 4-8, 2017, Angers, France

A. Mann (1), H. Lohmeyer (1) and Y. Josephy (2)
Characterization and monitoring structures for robustness against cyclic thermomechanical stress: design and influence of Ti-Al(Cu) layer scheme
(1) Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
(2) Technische Universitaet Bergakademie Freiberg, Institute of Electronic and Sensor Materials, Freiberg, Germany
30th International Conference on Microelectronic Test Structures, March 27-30, 2017, Grenoble, France

R. Weissnegger, C. Kreiner, M. Pistauer, K. Roemer, C. Steger
SHARC - Simulation and Verification of Hierarchical Embedded Microelectronic Systems
CISC Semiconductor GmbH, Graz University of Technology
8th International Conference on Ambient Systems, Networks and Technologies, May 16-19, 2017, Madeira, Portugal

S. Ristov, R. Mathá and R. Prodan
Analysing the performance instability correlation with various workflow and cloud parameters
University of Innsbruck, Austria
25th Euromicro International Conference on Parallel, Distributed, and Network-Based Processing, March 6-8,2017, St. Petersburg, Russia

A. Chvála, D. Donoval, J. Marek, M. Molnár, P. Príbytný
3-D device electrothermal simulation of power HEMT including package
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava, Slovakia
Workshop on Compound Semiconductor Devices and Integrated Circuits, June 8-10, 2015, Smolenice, Slovakia

J. Marek, L. Stuchlíková, M. Jagelka, A. Chvála, P. Pribytny, M. Donoval, D. Donoval
Study of repetitive avalanche stress invoked degradation of electrical properties of DMOS and TrenchMOS transistors
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava, Slovakia
11th International Conference on Advanced Semiconductor Devices And Microsystems, November 13-16, 2016, Smolenice, Slovakia

J. Marek, M. Jagelka, A. Chvála, P. Pribytny, M. Donoval, D. Donoval
Influence of repetitive avalanche stress on electrical properties of advanced automotive power transistors
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava, Slovakia
Workshop on Compound Semiconductor Devices and Integrated Circuits, June 6-10, 2016, Aveiro, Portugal

P. Príbytný, M. Mikolášek, J. Marek, A. Chvála, D. Donoval
Electro-physical 2-D/3-D TCAD analysis of reduce the temperature-related negative effects on silicon heterojunction solar cell for concentrated photovoltaic
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava, Slovakia
11th International Conference on Advanced Semiconductor Devices And Microsystems, November 13-16, 2016, Smolenice, Slovakia

J. Marek
The Influence of Repetitive UIS on Electrical Properties of Advanced Automotive Power Transistors
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava, Slovakia
Power Electronics Conference – SEMICON Europa, October 24-26, 2016, Grenoble, France

G. Parteder, J. Kraft, J. Siegert, T. Bodner, S. Jessenig, and F. Schrank
TSV with 40 µm diameter replacing wiring pads
ams AG, Austria
MiNaPAD Forum 2017, May 17-18, 2017, Grenoble, France

A. Munding, A. Kessler, T. Scharf, B. Plikat, K. Pressel
Laminate Chip Embedding Technology – Impact of Material Choice and Processing for Very Thin Die Packaging
Infineon Technologies AG, Munich, Germany
Electronic Components and Technology Conference (ECTC), May 30 - June 2, 2017, Lake Buena Vista, Florida