Joint press release by the “eRamp” research project partners

The Project eRamp is co-funded by grants from ENIAC Joint Undertaking and from Austria, Germany, the Netherlands, Romania, Slovakia und the UK.

ENIAC-ED-09
Part B
ENIAC-2013-2 - Call 9

Europe’s strengths are based on the deep knowledge and market position in automotive industry, industrial electronics industry and leading know how for More than Moore (MtM) based embedded system solutions.

It is of vital interest for the electronics manufacturers in Europe to have fast access to reliable prototypes of electronic devices as well as competitive advanced manufacturing of such devices made in Europe. eRamp will fully support these targets, in line with the KET-(Key Enabling Technologies) strategy, by strengthening Europe's leadership in power semiconductors by addressing (a) methodology research and (b) product development. Clear focus is put on fast and reliable product behavior by learning in European pilot line environments to get fast feedback for the development process.

In addition, eRamp will enable the realization of innovative MtM devices by development of innovative process and manufacturing chains. Research will focus on enhanced, next generation, MtM semiconductor product ramp ups, dedicated to energy efficient power, MEMS and 3D based applications. Power chip technologies based on 300mm wafer diameter will be enforced by combining them with advanced assembly and interconnect technologies based on chip embedding. Thus, eRamp will be a logical consequence of the running projects EPT300 and EPPL.