EconoDUAL™ 3 Wave

EconoDUAL™ 3 Wave for liquid-cooled applications

The EconoDUAL™ 3 is in use for more than 15 years in a wide variety of applications like CAV and wind.

Especially applications like electrified drive trains in heavy-duty vehicles pose a challenge for semiconductors in multitude of ways such as highly repetitive load cycles that define very demanding lifetime requirements.

Now, the EconoDUAL™ 3 Wave upgrades the existing package with a cooling structure on the backside to improve the thermal resistance without altering the other module features and characteristics. The new product in combination with an open water cooled heatsink leads to extraordinary cooling performance targeting a reduction of the semiconductor temperature. This leads to higher lifetime, e.g. 8 times higher (depends on application conditions) and higher output current. Moreover, a simplified inverter production induced by no thermal grease application can be achieved.

The EconoDUAL™ 3 Wave is tailored for liquid-cooled applications like CAV for the use in e-busses, e-trucks and delivery trucks where highest lifetime requirements have to be meet.

Key Features Benefits
  • Ribbon-bond structure on the backside of the Standard EconoDUAL™ 3 package
  • Latest TRENCHSTOP™ IGBT7 chip technology
  • Tailored for open and liquid-cooled applications
  • Extraordinary thermal performance
  • Higher lifetime (e.g. 8 times higher, depends on application condition) in the application induced by lower operation temperature
  • Enabling higher inverter output current (e.g. 30% more output current, depends on application condition)