EconoDUAL™ 3 Future Trends

Future trends within the EconoDUAL™ 3 Package

Our EconoDUAL™ 3 is one of the most popular power electronic packages on the market. It has been in use since 2005 in key applications such as general-purpose drives, electric buses and trucks, solar, wind, uninterruptible power supplies, chargers and traction. It is available today with a variety of IGBT technologies and topologies which are the basis for the time-being successful establishment of the EconoDUAL™ 3 on the worldwide semiconductor market.

To ensure the EconoDUAL™ 3 success and to meet the prospective application requirements, the package will offer specified module solutions like the EconoDUAL™ 3 Black Series, EconoDUAL™ 3 Wave and EconoDUAL™ 3 1700 V IGBT7 portfolio.
These new technologies will be equipped with the latest chip technology TRENCHSTOP™ IGBT7.
Optimal solutions are addressing specific customer needs such as highest power density, extended lifetime and best performance.

  • EconoDUAL™ 3 Black Series offers optimal price/performance ratio by combining new features with well-known advantages of the EconoDUAL™ 3 footprint.
  • EconoDUAL™ 3 Wave upgrades the existing package with a cooling structure on the backside to improve the thermal performance with an open liquid cooled heat sink which leads to increased output current.
  • New best-in-class EconoDUAL™ 3 1700 V 900 A module features significant lower conduction and switching losses, enhanced controllability of dv/dt and diode softness, as well as an overload capability at Tvj,op=175°C.

Details about EconoDUAL™ 3 Future Trends