Award-winning CoM design

The 2013 Global Frost & Sullivan Award for New Product Innovation Leadership went to our Coil on Module (CoM) packaging technology. Each year, Frost & Sullivan presents this award to the developer of an innovative element in a product that leverages leading-edge technologies. The award recognizes the value-added features/benefits of the product and the increased ROI it offers customers.

Frost & Sullivan acknowledged our CoM chip package and related card antenna designs for their ability to accelerate the introduction of cards that can be used for both contact-based as well as contactless applications. Highlights cited by the research and consulting organization include improved card robustness, up to five times faster manufacturing processes, flexible card design and minimal investments in new manufacturing equipment. It predicts that banks and financial institutions will benefit from improved performance, longer lifetimes and simplified supply chains for the final products.

“Infineon is a leading manufacturer of semiconductor solutions, which has enabled it to gain deeper expertise in manufacturing processes and subsequently, on ways to improve chips and packaging technologies,” said Frost & Sullivan Global Program Director, Digital Identification, ICT, Jean-Noel Georges. “Leveraging this experience, the company has developed a complete solution for dual-interface cards that bridges the gap from todays contact-based applications to tomorrows contactless world.”

> Frost & Sullivan award press release