The complexity and density of electronic modules is constantly increasing as more and more loads and functions are being implemented. Car manufacturers, automotive suppliers but also industry players are looking for modular and scalable solutions to adapt to a variety of options and re-use the developed electronics for further projects. At the same time, the modules need to be optimized in terms of size and weight.
The SPOC™ families, scaled by number of channels and added features, address these trends by implementing smart High Side drivers together with added intelligence inside one package. Full scalability is provided through the footprint and software compatibility within each SPOC™ family. Integration helps reducing the complexity of the electronics, allowing board space reduction and decreasing the need for external components. Control, configuration and diagnosis are carried out via a Serial Peripheral Interface (SPI), which saves pins on the microcontroller and provides flexibility for the solution. Furthermore, Fail Safe modes are supported, which enhances safety in operation.
SPOC™ provides decisive advantages on system level and for a wide range of applications.