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OptiMOS™ in TOLL package



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Need a small MOSFET to handle 300A? The innovative package for your high current applications with a 30% footprint reduction whilst eliminating electromigration.


High current applications such as power tools, light electric vehicles and fork lifts often result in MOSFETs being used in parallel, driving up board space and cost - not any longer. Infineon’s TO-Leadless MOSFET package is optimized to handle currents of up to 300A, increasing power density with a substantial reduction in footprint. A footprint reduction of 30% compared to D 2PAK, together with a height reduction of 50%, results in an overall space saving of 60% enabling much more compact designs.


The problem of electromigration is a challenge in high power and high temperature applications as well. Here again TO-Leadless is the ideal package solution. A 50% bigger solder contact area avoids electromigration leading to improvement in reliability. Infineon now offers five voltage classes for OptiMOS™ in TO-Leadless ranging from 30V to 150V.


Features Benefits Application
  • Industry‘s lowest R DS(on)
  • Highest current capability up to 300A
  • Very low package parasitics and inductances


  • Less paralleling and cooling required
  • Highest system reliability
  • System cost reduction
  • Enabling very compact design


5kW TO-Leadless evaluation board

This evaluation board is showing the performance of Infineon's power MOSFET family OptiMOS™ in the new TO-Leadless package in terms of parallelization and thermal behavior.

5 variants available:

  • 60V with IPT007N06N
  • 80V with IPT012N08N5
  • 100V with IPT015N10N5
  • 100V with IPT020N10N3
  • 120V with IPT059N15N3

Learn more


Product portfolio OptiMOS™ power MOSFETs in TO-Leadless package

Click on a product type to learn more, download datasheets and order

Package Product type V DS [V] R DS(on) max [mΩ]


30 0.4


60 0.7


60 1.2


80 1.2


100 1.5


100 2.0


80 2.9


150 5.9


200 11.1


250 21.0

*Evaluation board available:  5kW TO-leadless board

Product Brief

Title Size Date Version
436 KB 30 Jun 2017 01_00

Product Selection Guide

Title Size Date Version
1.2 MB 17 Aug 2015 01_00
22.2 MB 21 Feb 2017 00_00

Application Notes

Title Size Date Version
2 MB 01 Dec 2016 01_00
902 KB 13 Aug 2013 01_00
993 KB 01 Apr 2008 01_00
970 KB 19 Oct 2016 01_01
7 MB 25 Jun 2015 01_00
2.5 MB 10 Jun 2016 01_01
654 KB 17 Sep 2013 01_00
701 KB 30 Nov 2015 01_00
663 KB 01 Dec 2012 01_00

Application Brochure

Title Size Date Version
199 KB 18 Sep 2017 02_00
1.5 MB 27 Jun 2017 02_00


Title Size Date Version
1.6 MB 08 May 2013
2.2 MB 20 May 2014


Title Size Date Version
699 KB 10 Jun 2015 01_00

Additional Product Information

Title Size Date Version
229 KB 20 Aug 2015 01_00
219 KB 14 May 2013

Evaluation Boards

Board Family Description Status
EVAL_IPT015N10N5_TOLL MOSFET Evaluation Board for an inverter stage of high power motor control applications such as forklifts or low speed cars, available in five RDS(on) variants
  • 100V IPT015N10N5 1.5mΩ
  • 100V IPT020N10N3 2.0mΩ
  • 150V IPT059N15N3 5.9mΩ
  • 60V IPT007N06N 0.75mΩ
  • 80V IPT012N08N5 1.2mΩ
on request

Simulation Models

Title Size Date Version
1.1 MB 02 Nov 2016 01_00
eLearning Datasheet explanation

Datasheet parameters and diagrams explanation - how to use them in applications

Reading datasheets is sometimes a challanging task. In this training some important datasheet parameters and diagrams are explained more in detail.

TO-Leadless (TOLL): Package for High Current Applications

TO-Leadless (TOLL): package for high current applications

The new TO-Leadless package is optimized for high current applications, such as forklift, light electric vehicles (LEV), POL (point-of-load), e-fuse and telecom. This new package is a perfect solution for high power applications where highest efficiency, outstanding EMI behaviour as well as best thermal behaviour and space reduction are required.

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