OptiMOS™ 3 power MOSFET in TOLG package for higher thermal cycling on board performance
The OptiMOS™ power MOSFET IPTG210N25NM3FD comes in the improved TO-Leaded package with gullwing leads. With a compatible footprint to TO-Leadless, TOLG allows excellent electrical performance compared to D2PAK 7-pin with ~60 percent board space reduction. This new package in OptiMOS™ 3 - 250 V offers very low RDS(on) and is optimized to handle high current.
Thanks to the flexibility of gullwing leads, OptiMOS™ in TOLG package shows excellent solder joint reliability on Al-IMS board. This result in 2x higher thermal cycling on board (TCoB) compared to the standard requirements (IPC-9701).
Among the key benefits, TOLG ensures high efficiency, lower EMI as well as high power density.
Summary of Features
- Best in class technology
- High current rating >300 A
- Low ringing and voltage overshoot
- 60% space board reduction compared to D2PAK 7-pin
- Gullwing leads
- High performance capability
- High system reliability
- High efficiency and lower EMI
- Optimized board utilization
- High thermal cycling on board performance