IPLK70R1K2P7

Overview

700 V CoolMOS™ P7 superjunction MOSFET in ThinPAK 5x6 package

The CoolMOS™ P7 superjunction (SJ) MOSFET family is designed to address typical challenges in the low-power SMPS market, by offering excellent performance and ease-of-use, enabling improved form factors and price competitiveness. The ThinPAK 5x6 package is characterized by a very small footprint of 5x6 mm² and a very low profile with a height of 1 mm. Together with its benchmark low parasitics, these features lead to significantly smaller form factors and help to boost power density. This combination makes CoolMOS™ P7 in ThinPAK 5x6 a perfect fit for its target applications. The 700V CoolMOS™ P7 family is optimized for flyback topologies.

Summary of Features

Best-in-class FOM R_DS(on) * E_oss; reduced Q_g, C_iss and C_oss
Best-in-class DPAK R_DS(on) of 1200mΩ
Best-in-class V_(GS)th of 3V and smallest V_(GS)th variation of ± 0.5V
Integrated Zener diode ESD protection up to Class 2 (HBM)
Best-in-class quality and reliability
Low EMI
Wide range of R_DS(on)values
Fully optimized portfolio

Benefits

0.1% to 0.6% efficiency gain and 2°C to 8°C lower MOSFET temperature as compared to CoolMOS™ C3
Enabling higher power density designs, BOM savings and lower assembly cost
Easy to drive and to design-in
Power density improvement compared to latest CoolMOS™ charger technology
Better production yield by reducing ESD related failures
Less production issues and reduced field returns
Easy to select right parts for fine tuning of designs

Potential Applications